Senior Principal Hardware Lead — High-Speed, Dense PCBs

Hewlett Packard Enterprise; Sunnyvale (CA); Hybride; USD 181 000 - 367 000; Plein temps

Résumé du poste

Hewlett Packard Enterprise is seeking a Senior Principal Hardware Engineer in Sunnyvale, CA, onsite. The role leads end-to-end hardware design for next‑generation networking hardware, requires 10+ years on complex boards, FPGA development, SI/PI expertise, and collaboration across hardware, firmware, software, and mechanical teams.

You will drive high-density, high-power PCB designs with 100G/200G interfaces, work on liquid-cooled architectures, and partner with thermal and manufacturing teams

Qualifications

• 10+ years of hands-on hardware/board design experience in complex, high-performance systems.
• Experience with high-speed 100G/200G signaling or similar interfaces.
• Experience with high-density, high-power PCBs and electronic systems.
• Hands-on FPGA design and integration with hardware/firmware.
• Strong SI/PI knowledge and thermal considerations.

Responsabilités

• Own end-to-end hardware design lifecycle from concept to production.
• Lead high-performance, high-density circuit boards with strict electrical/thermal constraints.
• Design 100G/200G-class signaling interfaces and board architectures.
• Develop and review schematics, power architectures, clocks, high-speed interfaces, and FPGA solutions as needed.
• Collaborate with thermal, mechanical, firmware, software and manufacturing teams.

Connaissances

Hardware design

FPGA design

High-speed signaling

Liquid cooling

SI/PI

Cross-functional collaboration

Power integrity

Description du poste

Hewlett Packard Enterprise is seeking a Senior Principal Hardware Engineer in Sunnyvale, CA, onsite. The role leads end-to-end hardware design for next‑generation networking hardware, requires 10+ years on complex boards, FPGA development, SI/PI expertise, and collaboration across hardware, firmware, software, and mechanical teams.

You will drive high-density, high-power PCB designs with 100G/200G interfaces, work on liquid-cooled architectures, and partner with thermal and manufacturing teams