Senior Principal Engineer, Hardware Application Engineering — Board & System Design

Phizenix

Santa Clara (CA)

On-site

USD 200,000 - 250,000

Full time

14 days+

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Job summary

Phizenix is seeking a Senior Principal Engineer, Hardware Application Engineering — Board & System Design to lead the hardware design of high-speed networking and AI platforms in Santa Clara, CA. The role requires deep expertise in board design, SI/PI, and power/thermal management across multi-gigabit SerDes.

Responsibilities include driving architecture, schematic development, layout reviews, and board bring-up, while collaborating with silicon, firmware, and systems teams to optimize

Qualifications

  • Bachelor's, Master's, or PhD in Electrical Engineering, Computer Engineering, or related field.
  • 15+ years of hardware design, development, and validation for high-speed networking or compute systems.
  • 7+ years of board and system design for high-speed platforms (25G NRZ to 112G/224G PAM4 SerDes).
  • Experience owning full board design lifecycle from architecture to validation.
  • Experience delivering hardware reference designs for customers or internal platforms.
  • High-speed PCB stack-up and material selection.
  • Power architecture for high-current ASICs (PDN, sequencing, decoupling, tolerance).
  • Thermal design and mechanical integration.
  • Signal Integrity (SI) and Power Integrity (PI).
  • Hands-on bring-up and debugging with lab equipment.
  • Knowledge of high-speed interfaces (Ethernet, PCIe, DDR, SerDes).
  • DFR/DFM/DFT experience; customer-facing engagements; strong communication.

Responsibilities

  • Lead board and system hardware design for high-speed networking and AI platforms.
  • Drive architecture, schematic development, PCB layout reviews, validation, and bring-up.
  • Collaborate with silicon, firmware, and systems teams to optimize performance.
  • Review SI/PI analyses and support customer design reviews.
  • Provide technical leadership during customer engagements and platform deployment.
  • Develop technical documentation and deliver engineering training.
  • Serve as the technical bridge between customers, hardware engineering, and silicon teams.

Education

Bachelor's degree in Electrical/Computer Engineering

Tools

Cadence Allegro/Sigrity
Mentor/Siemens Xpedition/HyperLynx

Job description

Senior Principal Engineer, Hardware Application Engineering — Board & System Design
Required Qualifications
  • Bachelor's, Master's, or PhD in Electrical Engineering, Computer Engineering, or a related field.
  • 15+ years of hardware design, development, and validation experience for high-speed networking or compute systems.
  • 7+ years of board and system design experience supporting high-speed platforms with 25G NRZ to 112G/224G PAM4 SerDes.
  • Strong experience owning the complete board design lifecycle, including architecture, schematic design, layout guidance, board bring-up, and validation.
  • Experience developing and delivering hardware reference designs for customer or internal platform adoption.
  • High-speed PCB stack-up and material selection
  • Power architecture for high-current ASICs (PDN, sequencing, decoupling, tolerance analysis)
  • Thermal design and mechanical integration
  • Signal Integrity (SI) and Power Integrity (PI)
  • Hands-on experience with hardware bring-up, debugging, root-cause analysis, and lab equipment.
  • Strong knowledge of high-speed interfaces including Ethernet, PCIe, DDR, and modern SerDes technologies.
  • Experience with Design for Reliability (DFR), Design for Manufacturability (DFM), and Design for Testability (DFT).
  • Customer-facing experience supporting technical engagements and resolving deployment issues.
  • Excellent communication and technical presentation skills.
Preferred Qualifications
  • Experience with Ethernet switch platforms and AI networking/fabric architectures.
  • Experience designing platforms for hyperscale or megascale data centers.
  • Knowledge of ODM/CM manufacturing, qualification, and reliability testing.
  • Experience with advanced cooling technologies (liquid or immersion cooling).
  • Hands-on experience with Cadence Allegro/Sigrity or Mentor/Siemens Xpedition/HyperLynx.
  • Proven ability to influence product roadmaps and collaborate with cross-functional engineering teams.
Key Responsibilities
  • Lead board and system hardware design for high-speed networking and AI platforms.
  • Drive architecture, schematic development, PCB layout reviews, hardware validation, and board bring-up.
  • Collaborate with silicon, firmware, and systems engineering teams to optimize platform performance.
  • Review SI/PI analysis and support customer design reviews.
  • Provide technical leadership during customer engagements and platform deployment.
  • Develop technical documentation and deliver engineering training.
  • Serve as the technical bridge between customers, hardware engineering, and silicon development teams

$200,000 - $250,000 USD

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