Senior Principal Engineer - Advanced Packaging Leader

ASM; North Carolina; On-site; USD 110,000 - 150,000; Full time

Job summary

ASM is hiring engineers across multiple experience levels to design and develop next-generation semiconductor equipment within the Advanced Packaging team. You will help ensure reliability from early concept through high-volume manufacturing, collaborating with hardware, software, and process teams across global sites.

You will contribute to system-level troubleshooting, NPI, automation, and performance improvements while mentoring peers and supporting customers in diverse environments.

Qualifications

• Degree in Engineering required at least one of Bachelor/Master/PhD
• Experience in semiconductor equipment or complex technical environments
• Knowledge of CE, NFPA, Semi S2-95 and other relevant standards

Responsibilities

• Contribute to design and development of semiconductor systems, including equipment selection, process controls, and automation integration.
• Manage project timelines, budgets, and resources while ensuring safety and quality standards.
• Collaborate with cross-functional teams in manufacturing, operations, and quality to align goals and deliverables.
• Provide technical support and troubleshooting for equipment and automation systems, driving root cause analysis and resolution.
• Own BOM release and maintenance, ensuring accurate documentation and reporting for stakeholders.
• Drive continuous improvement initiatives and stay current with industry trends and emerging technologies.
• Prepare comprehensive design documentation for manufacturing and testing of prototypes and production products.
• Act as a system-level technical expert, supporting complex semiconductor equipment in both development labs and customer fabs.
• Diagnose and resolve advanced system, hardware, and process issues, including escalations beyond standard support.
• Drive root cause analysis (RCCA) and implement sustainable solutions across tools, sites, and product lines.
• Support new product introduction (NPI), including early builds, lab validation, and ramp to high-volume manufacturing.
• Lead or support first-in-fab deployments — installation, start-up, and qualification.
• Translate field and customer feedback into design, performance, and reliability improvements.
• Contribute to yield improvement, tool performance, and uptime in demanding fab environments.
• Develop and share best practices, technical documentation, and global standards.
• Collaborate cross-functionally with hardware, software, controls, and process engineering teams.
• Lead / Support global initiatives, mentor engineers and represent ASM in customer-facing teams

Skills

Systems thinking

Problem solving

Hands-on engineering

Communication skills

Education

Bachelor’s, Master’s or PhD in Engineering

Job description

ASM is hiring engineers across multiple experience levels to design and develop next-generation semiconductor equipment within the Advanced Packaging team. You will help ensure reliability from early concept through high-volume manufacturing, collaborating with hardware, software, and process teams across global sites.

You will contribute to system-level troubleshooting, NPI, automation, and performance improvements while mentoring peers and supporting customers in diverse environments.