Senior Principal Engineer, Global Product Management - Advanced Packaging

ASM; Phoenix (AZ); On-site; USD 130,000 - 180,000; Full time

Job summary

ASM is seeking a Senior Engineer, Global Product Management in its Advanced Packaging business. You will shape product strategy, drive roadmaps, and lead cross-functional teams across R&D, engineering, and operations to commercialize next-gen packaging solutions.

You will build strategic customer relationships, translate market needs into product plans, and manage business cases including NPV/IRR analyses while traveling up to 25–35% globally.

Qualifications

• 5–10 years in product management, technical marketing, applications engineering, or related fields in semiconductors.
• Strong understanding of advanced packaging technologies and market trends.
• Experience translating market needs into product strategies and business opportunities.
• Ability to lead cross-functional teams and present compelling business cases.

Responsibilities

• Lead product platforms from concept to commercialization and end-of-life.
• Define roadmaps for hybrid bonding, chiplets, 2.5D/3D integration, and related tech.
• Own requirements, configurations, and platform options for diverse customers.
• Develop Voice of Customer programs and strategic relationships with manufacturers and OSATs.
• Drive market assessments, TAM analysis, segmentation, and go-to-market plans.
• Partner with finance to evaluate investments using NPV, IRR, ROI.
• Lead NPI and market readiness activities for new launches.

Skills

Product strategy

Cross-functional leadership

Market analysis

Business case development

Global collaboration

Customer engagement

Strategic thinking

Education

Master’s or PhD in Materials Science, Electrical Eng, Chemical Eng, Physics, or Mech Eng

Job description

Step into a career with ASM, where cutting edge technology meets collaborative culture.

For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving.Butwe’re more than just a tech company. We value diversity, inclusion and sustainability as we strive to make a positive impact on the world. Our development programs help support your growth, shaping your future and pushing the boundaries of innovation to unleash potential.

As a Senior Engineer, Global Product Management within ASM's Advanced Packaging business, you will play a critical role in shaping the technologies that enable next-generation semiconductor devices. This position offers a unique opportunity to work at the intersection of product strategy, technology development, and customer engagement, helping drive innovations in advanced packaging, heterogeneous integration, chiplet architectures, and next-generation interconnect solutions.

You will collaborate closely with leading semiconductor manufacturers, OSATs, IDM customers, and cross-functional teams across R&D, engineering, operations, and sales to define and commercialize differentiated solutions that address the rapidly evolving advanced packaging market. This role is ideal for a technically strong, customer-focused individual who enjoys translating market needs into successful products and business growth.

Key Responsibilities

• Product Lifecycle Management: Lead advanced packaging product platforms from concept through commercialization, high-volume manufacturing, and end-of-life, ensuring alignment with customer roadmaps and business objectives.
• Technology & Product Roadmap Development: Define and maintain product roadmaps that support emerging advanced packaging applications, including hybrid bonding, chiplets, 2.5D/3D integration, HBM, wafer-to-wafer and die-to-wafer processes.
• Product Definition & Configuration Management: Own product requirements, configurations, and platform options to address diverse customer manufacturing requirements while maintaining operational efficiency.
• Customer Engagement & Voice of Customer: Develop strategic relationships with leading semiconductor manufacturers, foundries, and OSATs to understand technology requirements, future packaging trends, and competitive positioning.
• Market Requirements Specification (MRS): Develop and manage comprehensive market and product requirement documents aligned with customer technology roadmaps and market inflection points.
• Strategic Marketing & Business Development: Drive market assessments, TAM analysis, customer segmentation, competitive benchmarking, and go-to-market strategies to support business growth.
• Financial & Business Analysis: Partner with finance and business leadership to evaluate investment opportunities, develop business cases, and assess product profitability using NPV, IRR, and ROI methodologies.
• Market Intelligence & Competitive Analysis: Monitor advanced packaging industry trends, competitor activity, customer technology roadmaps, and emerging market opportunities.
• New Product Introduction (NPI): Lead the business planning and market readiness activities for new product launches, including customer adoption strategies, positioning, and value proposition development.
• Cross-Functional Technology Leadership: Collaborate with R&D, engineering, applications, and operations teams to prioritize product development efforts and ensure alignment with customer requirements.
• Strategic Ecosystem & Supplier Engagement: Build partnerships with key materials suppliers, technology partners, research institutes, and industry consortia to support technology development and market adoption.
• Industry Presence & Product Promotion: Represent ASM at industry conferences, customer events, and technology forums; develop product messaging, technical presentations, and sales enablement materials.

Requirements

• 5-10 years of experience in product management, technical marketing, applications engineering, process engineering, or business development within the semiconductor industry.
• Master’s or PhD in Materials Science, Electrical Engineering, Chemical Engineering, Physics, Mechanical Engineering, or a related technical field.
• Strong understanding of advanced packaging technologies, including heterogeneous integration, chiplet architectures, hybrid bonding, wafer-level packaging (WLP), panel-level packaging (PLP), 2.5D/3D integration, TSVs, redistribution layers (RDL), and advanced interconnect technologies.
• Knowledge of semiconductor manufacturing processes and equipment, particularly deposition, surface preparation, thermal processing, or related front-end and back-end technologies.
• Experience working with semiconductor manufacturers, foundries, OSATs, or advanced packaging organizations.
• Strong customer-facing skills with demonstrated success influencing technical and business stakeholders.
• Ability to translate technology trends and customer needs into product strategies and commercial opportunities.
• Proven ability to collaborate effectively across global, cross-functional teams.
• Strong analytical, presentation, and business case development skills.
• Willingness and ability to travel globally (up to 25-35%).

Preferred Qualifications

• Direct experience supporting advanced packaging applications for AI, HPC, HBM, or next-generation logic devices.
• Familiarity with hybrid bonding, dielectric and metallization processes, wafer-to-wafer and die-to-wafer integration, or related advanced packaging process technologies.
• Experience with semiconductor capital equipment product management, strategic marketing, or new product introduction.

We make the tech that enables the chips in devices which improve lives around the world. We do this with an eye to the future, pushing the boundaries of what’s possible through cutting-edge innovation, and driving the next wave of technological breakthroughs that shape how we live, work, and connect.

To learn more about ASM, find us atasm.com andon LinkedIn,Facebook,Instagram,XandYouTube.

ASM is an equal opportunity employer and considers qualified applicants for employment without regard to race, color, religion, age, nationality, social or ethnic origin, sexual orientation, gender, gender identify or expression, marital status, pregnancy, political affiliation, disability, genetic information, veteran status, or any other characteristic protected by law.