Senior Power Integrity Engineer for AI Photonics

Doist; San Jose (CA); On-site; USD 180,000 - 250,000; Full time

Job summary

Lumilens is seeking a Senior/Principal Power Integrity Engineer to own and drive power delivery strategies across complex 2.5D/3D packages that integrate electrical ICs, photonic ICs, chiplets, and high-bandwidth memory. You’ll architect robust PDNs for extreme power densities and ultra-high-speed signaling.

You will model, simulate, and validate PI solutions using industry tools, lead cross-functional collaboration with silicon, package, and photonics teams, and own PI qualification from lab

Qualifications

• Deep expertise in power integrity for high-performance semiconductors.
• Experience with 2.5D/3D integration and chiplet architectures.
• Proven ability to lead cross-functional programs with foundries/OSATs.

Responsibilities

• Define power integrity architectures for 2.5D/3D heterogeneous integration.
• Perform full-stack PI analysis from die-level IR drop to package-level PDN validation.
• Model, simulate, and validate PI solutions using industry tools across silicon, interposer, substrate, and board interfaces.
• Lead PI co-design with silicon, package, and photonics teams to optimize layouts and materials.
• Drive qualification of power components and collaborate with foundries on capabilities and yield.
• Develop PI methodologies and sign-off criteria for AI accelerators and chiplet systems.
• Own PI qualification, lab validation, and readiness for volume production ramp.

Skills

Power integrity

PDN design

EM analysis

PI simulation tools

2.5D/3D integration

Chiplets

Interposers/bridges

VLSI/packaging interaction

Education

Bachelor’s degree in Electrical Engineering or Physics

10+ years experience in power integrity

Master’s or PhD (preferred)

Tools

Ansys SIwave

Cadence Sigrity

Keysight ADS

Apache RedHawk

Voltus

Job description

Lumilens is seeking a Senior/Principal Power Integrity Engineer to own and drive power delivery strategies across complex 2.5D/3D packages that integrate electrical ICs, photonic ICs, chiplets, and high-bandwidth memory. You’ll architect robust PDNs for extreme power densities and ultra-high-speed signaling.

You will model, simulate, and validate PI solutions using industry tools, lead cross-functional collaboration with silicon, package, and photonics teams, and own PI qualification from lab