Senior Post-Fab Module Engineer: Lead Tooling & Yield

onsemi; Hopewell Junction (NY); On-site; USD 140,000 - 200,000; Full time

Job summary

onsemi is seeking a highly motivated Senior Module Engineer to join the 300mm Post Fab team in East Fishkill, NY. You will lead toolsets, drive process improvements, and oversee high-volume manufacturing initiatives for wafer operations.

The role requires 8+ years in semiconductor manufacturing, strong leadership, and deep knowledge of metrology, DOE, and SPC to deliver yield, throughput, and cost improvements.

Qualifications

• Bachelor’s degree or higher in Chemical Engineering, Mechanical Engineering, Electrical Engineering, Materials Science, Physics, or related field.
• 8+ years of direct work experience in the semiconductor industry with manufacturing improvement and process development experience.

Responsibilities

• Owns multiple toolsets in Post Fab and leads improvement roadmaps for equipment and processes.
• Develops new processes and scales to high-volume manufacturing.
• Evaluates and qualifies new materials, processes, and equipment for Post Fab wafer operations.
• Troubleshoots process issues and implements corrective actions to improve yield and device performance.
• Leads tool matching, owns process windows, and interfaces with suppliers on tool roadmaps.

Skills

Semiconductor manufacturing

Data analysis

Yield improvement

Project leadership

Communication

Mentorship

Education

Bachelor’s degree or higher in Chemical Engineering / Mechanical Engineering / Electrical Engineering / Materials Science / Physics

Tools

SPC

DOE

Data analysis software

Metrology & inspection techniques

Job description

onsemi is seeking a highly motivated Senior Module Engineer to join the 300mm Post Fab team in East Fishkill, NY. You will lead toolsets, drive process improvements, and oversee high-volume manufacturing initiatives for wafer operations.

The role requires 8+ years in semiconductor manufacturing, strong leadership, and deep knowledge of metrology, DOE, and SPC to deliver yield, throughput, and cost improvements.