Senior PIC Design & Analysis Engineer - Visible/IR

SPECTRAFORCE

Redmond (WA)

On-site

USD 103,000 - 110,000

Full time

14 days+
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Job summary

SPECTRAFORCE is seeking an Optical Engineer III - Design Analysis in Redmond, WA to design, simulate, and optimize Photonic Integrated Circuits for visible/IR wavelengths with emphasis on active device integration.

You will generate fabrication-ready layouts, verify PDk compliance, and collaborate across cross-functional teams to tapeout PICs. The role requires MS/Ph.D. and 3+ years of experience in PIC design and photonics.

Qualifications

  • MS or Ph.D. in Electrical Engineering, Optical Sciences, Physics, or closely related field.
  • 3+ years designing, simulating, and layout of PICs for visible or IR wavelengths.
  • Experience with photonic device simulation and EM modeling tools.
  • 2+ years with PIC layout tools and GDSII generation; familiarity with foundry PDKs.
  • 2+ years of scientific programming (Python or MATLAB).
  • 1+ years supporting PIC tapeouts at a commercial foundry.

Responsibilities

  • Design, simulate, and optimize PICs and photonic devices.
  • Prepare fabrication-ready layouts and ensure PDK compliance.
  • Analyze designs with parametric studies and drive design decisions.
  • Coordinate design-to-fabrication pipeline with cross-functional teams.

Skills

PIC Design & Simulation
Photonic Modeling Tools
PIC Layout & Tapeout
Python / MATLAB

Education

MS or Ph.D. in Electrical Engineering or Optical Sciences

Tools

Lumerical
Ansys Photonics
Synopsys RSoft
COMSOL
KLayout
Cadence Virtuoso
gdsfactory

Job description

SPECTRAFORCE is seeking an Optical Engineer III - Design Analysis in Redmond, WA to design, simulate, and optimize Photonic Integrated Circuits for visible/IR wavelengths with emphasis on active device integration.

You will generate fabrication-ready layouts, verify PDk compliance, and collaborate across cross-functional teams to tapeout PICs. The role requires MS/Ph.D. and 3+ years of experience in PIC design and photonics.

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