Senior Packaging Technical Engineer - Hardware

NVIDIA AI

California (MO)

On-site

USD 168,000 - 322,000

Full time

10 days ago

Get more replies from employers

Send a job-specific resume in minutes.

Job summary

NVIDIA is seeking an experienced engineer to define and implement the chip pad ring and substrate interconnect scheme, leading the package layout design across multidisciplinary teams. You will contribute to floor planning, pad ring and ball-out strategies to ensure a robust electrical package.

The role requires 8+ years in board/system design, with package design experience preferred, and a strong grasp of transmission line theory and SI. Equity and benefits are included.

Qualifications

  • BSEE or equivalent experience.
  • Minimum of 8+ years in board/system design; package design experience preferred.
  • Strong understanding of transmission line theory, power delivery and signal integrity.
  • Programming/scripting in Perl, Python, Tcl; Cadence and Excel familiarity useful.
  • Hardworking and able to work with a minimum of supervision.
  • You seek to solve complex technical problems.

Responsibilities

  • Define and implement the chip pad ring, substrate interconnect scheme, and lead the package layout design process.
  • We collaborate with large teams consisting of Circuit, SI, RTL, Place and Route, substrate layout and system design Engineers and Managers.
  • Work to define a chip floor plan, pad ring, substrate, and ball out implementing a robust world-class electrical package.
  • Communicate effectively with various teams throughout the company

Skills

Board design
System design
Signal integrity
Perl scripting
Python scripting
Tcl scripting

Education

BSEE or equivalent experience

Tools

Cadence
Excel

Job description

Job Requisition ID

JR2022839

Job Category

Engineering

Time Type

Full time

Today, we’re tapping into the unlimited potential of AI to define the next era of computing. An era in which our GPU acts as the brains of computers, robots, and self-driving cars that can understand the world. Doing what’s never been done before takes vision, innovation, and the world’s best talent. As an NVIDIAN, you’ll be immersed in a diverse, supportive environment where everyone is inspired to do their best work. Come join the team and see how you can make a lasting impact on the world.

Our dynamic work environment demands proactive ownership, as you’ll play a key role in driving technology across multiple functions. In this position, you’ll be responsible for crafting and implementing silicon pad rings, as well as working with a variety of package technology types and complex technologies. This is not just another engineering role—it’s a unique opportunity that actively encourages innovative, out-of-the-box problem solvers to contribute and shape the future of our technology.

What You’ll Be Doing
  • Your responsibilities include defining and implementing the chip pad ring, substrate interconnect scheme, and lead the package layout design process.
  • We collaborate with large teams consisting of Circuit, Signal Integrity, RTL, Place and Route, substrate layout and system design Engineers and Managers.
  • Work to define a chip floor plan, pad ring, substrate, and ball out implementing a robust world-class electrical package!
  • Communicate effectively with various teams throughout the company
What We Need To See
  • BSEE or equivalent experience.
  • Minimum of 8+ years in board/system design. Experience with package design is preferred.
  • Good understanding of transmission line theory, power delivery and signal integrity is desired.
  • It is preferred to have programming and scripting skills in Perl, Python, Tcl desired, Cadence Skill and EXCEL familiarity are useful and a plus.
  • Hardworking and able to work with a minimum of supervision.
  • You seek to solve complex technical problems.

Widely considered to be one of the technology world’s most desirable employers, NVIDIA offers highly competitive salaries and a comprehensive benefits package. As you plan your future, see what we can offer to you and your family www.nvidiabenefits.com/

Your base salary will be determined based on your location, experience, and the pay of employees in similar positions. The base salary range is 168,000 USD - 258,750 USD for Level 4, and 200,000 USD - 322,000 USD for Level 5.

You will also be eligible for equity and benefits.

Applications for this job will be accepted at least until August 10, 2026.

This posting is for an existing vacancy.

NVIDIA uses AI tools in its recruiting processes.

NVIDIA is committed to fostering an inclusive work environment and proud to be an equal opportunity employer. As we highly value diversity in our current and future employees, we do not discriminate (including in our hiring and promotion practices) on the basis of race, religion, color, national origin, gender, gender expression, sexual orientation, age, marital status, veteran status, disability status or any other characteristic protected by law.

Get your free, confidential resume review.
or drag and drop your file here.
Similar jobs

Similar jobs worth comparing

Senior Packaging Technical Engineer - Hardware
Senior Packaging Technical Engineer - Hardware

Nvidia Corporation in • Santa Clara (CA)

On-site
USD 168,000 - 322,000
Equity
Senior Packaging Technical Engineer - Hardware
Senior Packaging Technical Engineer - Hardware

2100 NVIDIA USA • California (MO)

On-site
USD 168,000 - 322,000
Senior Packaging Technical Engineer - Hardware
Senior Packaging Technical Engineer - Hardware

NVIDIA Gruppe • California (MO)

On-site
USD 168,000 - 322,000
Senior Packaging Technical Engineer - Hardware
Senior Packaging Technical Engineer - Hardware

NVIDIA • California (MO)

On-site
USD 168,000 - 322,000
Equity
Benefits
Package Design Methodology Engineer
Package Design Methodology Engineer

NVIDIA AI • Santa Clara (CA)

On-site
USD 136,000 - 265,000
Equity
Benefits package
Competitive salaries
Package Design Methodology Engineer
Package Design Methodology Engineer

NVIDIA • California (MO)

On-site
USD 136,000 - 265,000
Equity
Benefits package
Package Design Methodology Engineer
Package Design Methodology Engineer

NVIDIA • Austin (TX)

On-site
USD 136,000 - 265,000
Equity
Benefits package
Senior System and Manufacturing CoDesign Architect - Power, Thermal and Packaging
Senior System and Manufacturing CoDesign Architect - Power, Thermal and Packaging

Nvidia Corporation in • Santa Clara (CA)

Hybrid
USD 196,000 - 368,000
Equity
Benefits package
Senior IC Packaging Development Engineer
Senior IC Packaging Development Engineer

NVIDIA • Santa Clara (CA)

On-site
USD 216,000 - 345,000
Senior Board Design Engineer
Senior Board Design Engineer

NVIDIA AI • Santa Clara (CA)

On-site
USD 196,000 - 311,000
Equity
Benefits