Senior Packaging Technical Engineer - Hardware

NVIDIA; California (MO); On-site; USD 168,000 - 322,000; Full time

Benefits offered by this job

Equity

Benefits

Job summary

NVIDIA is seeking a highly experienced engineer to design chip pad rings, substrates, and robust electrical packages. You will lead the package layout process and collaborate with circuit, SI, RTL, and system design teams to define floor plans and interconnect schemes.

The role requires 8+ years in board/system design with package experience, strong signal integrity understanding, and scripting skills. Equity and benefits are offered; applications accepted until Aug 10, 2026.

Qualifications

• BSEE or equivalent experience.
• Minimum of 8+ years in board/system design; package design is preferred.
• Strong understanding of transmission line theory, power delivery and signal integrity.
• Scripting in Perl, Python, Tcl; Cadence skills and Excel familiarity are a plus.
• Self-driven and able to work with minimal supervision to solve complex technical problems.

Responsibilities

• Define and implement the chip pad ring, substrate interconnect scheme, and lead the package layout design process.
• Collaborate with teams across Circuit, Signal Integrity, RTL, Place and Route, substrate layout and system design engineers and managers.
• Define a chip floor plan, pad ring, substrate, and ball out implementing a robust world-class electrical package.
• Communicate effectively with various teams throughout the company.

Skills

Perl

Python

Tcl

Cadence

Excel

Signal integrity

Power delivery

Transmission line theory

Hardworking

Problem solving

Education

BSEE or equivalent

Tools

Cadence

Excel

Job description

Today, we’re tapping into the unlimited potential of AI to define the next era of computing. An era in which our GPU acts as the brains of computers, robots, and self-driving cars that can understand the world. Doing what’s never been done before takes vision, innovation, and the world’s best talent. As an NVIDIAN, you’ll be immersed in a diverse, supportive environment where everyone is inspired to do their best work. Come join the team and see how you can make a lasting impact on the world.

Our dynamic work environment demands proactive ownership, as you’ll play a key role in driving technology across multiple functions. In this position, you’ll be responsible for crafting and implementing silicon pad rings, as well as working with a variety of package technology types and complex technologies. This is not just another engineering role—it’s a unique opportunity that actively encourages innovative, out-of-the-box problem solvers to contribute and shape the future of our technology.

What You\'ll Be Doing

• Your responsibilities include defining and implementing the chip pad ring, substrate interconnect scheme, and lead the package layout design process.
• We collaborate with large teams consisting of Circuit, Signal Integrity, RTL, Place and Route, substrate layout and system design Engineers and Managers.
• Work to define a chip floor plan, pad ring, substrate, and ball out implementing a robust world-class electrical package!
• Communicate effectively with various teams throughout the company

What We Need To See

• BSEE or equivalent experience.
• Minimum of 8+ years in board/system design. Experience with package design is preferred.
• Good understanding of transmission line theory, power delivery and signal integrity is desired.
• It is preferred to have programming and scripting skills in Perl, Python, Tcl desired, Cadence Skill and EXCEL familiarity are useful and a plus.
• Hardworking and able to work with a minimum of supervision.
• You seek to solve complex technical problems.

Your base salary will be determined based on your location, experience, and the pay of employees in similar positions. The base salary range is 168,000 USD - 258,750 USD for Level 4, and 200,000 USD - 322,000 USD for Level 5.

You will also be eligible for equity and benefits.

Applications for this job will be accepted at least until August 10, 2026.

This posting is for an existing vacancy.

NVIDIA uses AI tools in its recruiting processes.

NVIDIA is committed to fostering an inclusive work environment and proud to be an equal opportunity employer. As we highly value diversity in our current and future employees, we do not discriminate (including in our hiring and promotion practices) on the basis of race, religion, color, national origin, gender, gender expression, sexual orientation, age, marital status, veteran status, disability status or any other characteristic protected by law.

, , JR2022839