Senior Packaging Engineer, Thermal Systems for Space AI

SpaceX; Bastrop (TX); On-site; USD 130,000 - 180,000; Full time

Job summary

SpaceX seeks a Sr. Packaging Engineer – Thermal Materials for the Starmind AI satellites program.

You will own the lifecycle of advanced packaging, from materials selection to prototyping and manufacturing, enabling on-orbit AI compute and data center workloads. You will collaborate with mechanical, thermal, materials, electrical, software, test engineering, and supply chain teams to deliver highly integrated hardware.

Qualifications

• Bachelor's degree in materials science, mechanical engineering, or a similar discipline.
• 5+ years experience in microelectronics device research or manufacturing.
• Experience with packaging, thermal management, and hardware development.

Responsibilities

• Own the full lifecycle of advanced packaging through board assembly process development.
• Drive system trades, requirements capture, materials selection, prototyping, manufacturing, failure analysis.
• Spearhead the development integrated thermal solutions including next generation TIMs to improve package performance.
• Own the full lifecycle of equipment specification, qualification, and ramp.
• Build supply chains for die, packages, components, consumable chemicals, and equipment for satellite compute manufacturing.
• Collaborate with engineers from mechanical, thermal, materials, electrical, software, test engineering, and supply chain.

Skills

Packaging engineering

Materials science

Mechanical engineering

Process development

GD&T

Precision assembly

Education

Bachelor's degree in materials science, mechanical engineering, or similar discipline

Tools

MATLAB

JMP

PFMEA

SPC

MES

Job description

SpaceX seeks a Sr. Packaging Engineer – Thermal Materials for the Starmind AI satellites program.

You will own the lifecycle of advanced packaging, from materials selection to prototyping and manufacturing, enabling on-orbit AI compute and data center workloads. You will collaborate with mechanical, thermal, materials, electrical, software, test engineering, and supply chain teams to deliver highly integrated hardware.