Senior Packaging Engineer: Orbital AI & Thermal Systems

United States Digital Space LLC; Bastrop (TX); On-site; USD 130,000 - 170,000; Full time

Job summary

United States Digital Space LLC is seeking a Sr. Packaging Engineer for the Starmind program in Texas.

You will own the full lifecycle of advanced packaging for thermal management, proposed TIMs, materials selection, prototyping, and teardown analysis to enable on-orbit AI compute. You’ll collaborate across mechanical, thermal, materials, electrical and software teams, drive supplier qualification, and help build manufacturing readiness for satellite compute hardware.

Qualifications

• Bachelor's degree in a relevant field is required.
• Minimum 5 years in microelectronics or related manufacturing.
• Experience with packaging, thermal, and reliability testing.

Responsibilities

• Own the full lifecycle of advanced packaging through board assembly process development.
• Drive system trades, requirements capture, and materials selection.
• Spearhead development of integrated thermal solutions including next-gen TIMs.
• Define equipment specifications, qualification, and ramp.
• Build supply chains for die, packages, components, and materials.
• Collaborate with mechanical, thermal, materials, electrical, software, and test teams.
• Mentor engineers and manage compliance with safety and environmental standards.
• Support leadership and cross-department collaboration to deliver high-performance hardware.

Skills

Packaging engineering

Thermal management

Materials selection

Failure analysis

Education

Bachelor's degree in materials science or mechanical engineering

Tools

Fixture design

Process capability

Job description

United States Digital Space LLC is seeking a Sr. Packaging Engineer for the Starmind program in Texas.

You will own the full lifecycle of advanced packaging for thermal management, proposed TIMs, materials selection, prototyping, and teardown analysis to enable on-orbit AI compute. You’ll collaborate across mechanical, thermal, materials, electrical and software teams, drive supplier qualification, and help build manufacturing readiness for satellite compute hardware.