Senior Packaging Architect for Quantum Ion Traps

Quantinuum; Broomfield (CO); Hybrid; USD 208,000 - 260,000; Full time

Benefits offered by this job

Health, dental, and vision insurance

401(k) match

Equity

12 paid holidays

Generous vacation

Parental leave

Employee discounts

Job summary

Quantinuum seeks a Chief Packaging Engineer to lead the packaging architecture for next‑gen ion traps, working with physicists, engineers, and external partners. The role balances technical leadership with hands‑on contribution and vendor collaboration to own the packaging roadmap.

You will oversee cross‑functional teams, guide packaging strategies for high‑density I/O devices, and ensure manufacturability while aligning with system requirements.

Qualifications

• Bachelor’s degree with 18+ years in advanced semiconductor packaging development, or Master’s with 15+ years, or PhD with 12+ years.
• U.S. Person required (citizen, permanent resident, or green card holder) due to contractual requirements.
• National security requirement: not a PRC or Russian national unless also a U.S. citizen.

Responsibilities

• Define, develop, and drive an advanced packaging architecture for ion traps with complex interfaces.
• Lead cross-functional teams to develop packaging strategies for high I/O density chips.
• Oversee packaging requirements for mechanical, thermal, electrical, and optical performance.
• Collaborate with vendors to implement and validate packaging processes.
• Support all stages of ion trap development and ensure manufacturability.
• Guide a team of packaging engineers and interface with the broader Quantinuum team.
• Foster external partnerships and co-development opportunities.

Skills

Team leadership

Cross-functional collaboration

Vendor collaboration

Strategic planning

Education

Bachelor’s degree + 18+ years experience

Master’s degree + 15+ years experience

PhD + 12+ years experience

Job description

Quantinuum seeks a Chief Packaging Engineer to lead the packaging architecture for next‑gen ion traps, working with physicists, engineers, and external partners. The role balances technical leadership with hands‑on contribution and vendor collaboration to own the packaging roadmap.

You will oversee cross‑functional teams, guide packaging strategies for high‑density I/O devices, and ensure manufacturability while aligning with system requirements.