Director of Quantum Packaging Engineering

Steneg; Boulder (CO); On-site; USD 150,000 - 190,000; Full time

Job summary

Steneg is pursuing a Head of Packaging Engineering to lead architecture and development of advanced semiconductor packaging for next-generation ion trap devices. The role partners with physicists, engineers and external suppliers to define long-term roadmaps balancing leadership and hands-on contribution.

The candidate will guide mechanical, thermal, electrical and photonic packaging interfaces, ensuring manufacturability, reliability and system-level performance in a highly collaborative,

Qualifications

• Bachelor's degree in Engineering, Physics, Materials Science or related field.
• Minimum of 10 years of experience in advanced semiconductor packaging development.
• Experience leading complex technical projects and multidisciplinary engineering initiatives.
• Strong expertise in semiconductor packaging technologies with mechanical, thermal, electrical and photonic interfaces.
• Experience working with external manufacturing partners and technology suppliers.
• Excellent communication, stakeholder management and technical leadership skills.
• Ability to work effectively in multidisciplinary and international engineering environments.

Responsibilities

• Define, develop and drive advanced packaging architecture for next-gen ion trap devices.
• Establish long-term packaging roadmaps aligned with product development.
• Evaluate emerging packaging technologies to support future scalability.
• Lead cross-functional teams developing packaging strategies for high-density devices.
• Define and oversee development activities to validate packaging performance.
• Provide leadership to ensure manufacturability and reliability.
• Collaborate with external vendors and partners to advance packaging processes.

Skills

Packaging architecture

Leadership

Cross-functional teamwork

Communication

Multidisciplinary collaboration

Education

Bachelor's degree in Engineering/Physics/Materials Science

Master's degree or PhD in Physics/EE/Materials Science

Job description

Steneg is pursuing a Head of Packaging Engineering to lead architecture and development of advanced semiconductor packaging for next-generation ion trap devices. The role partners with physicists, engineers and external suppliers to define long-term roadmaps balancing leadership and hands-on contribution.

The candidate will guide mechanical, thermal, electrical and photonic packaging interfaces, ensuring manufacturability, reliability and system-level performance in a highly collaborative,