Senior Microelectronics Assembler - Precision Under Microscope

Honeywell Aerospace; San Jose (CA); On-site; USD 44,000 - 55,000; Full time

Job summary

Honeywell Aerospace is seeking a skilled assembler to impact production line efficiency and quality, ensuring correct assembly and conformance to specifications. You will work with microelectronic, RF, and semiconductor components, using wire bonding, die attach, and other precision techniques, often under a microscope.

Responsibilities include equipment setup, calibration, and collaboration with Process and Quality Engineering to resolve procedure challenges. A U.S.

Qualifications

• At least 4 years prior work experience in microelectronic, RF, hybrid and/or semiconductor assembly.
• Proficiency in at least three of the following skills: wire bonding, gap welding, eutectic die attach, epoxy attach.
• Be able to handle devices and other small components using tweezers under a microscope.
• Basic computer skills for documenting defects and time charging.
• Equipment setup and calibration.
• Routine preventative maintenance tasks.
• Ability to obtain and maintain a security clearance.
• This position requires access to technology, materials, software or hardware controlled by US export laws.

Responsibilities

• Proficiency in at least three of the listed assembly skills.
• Work independently and own quality, driving continual improvements.
• Participate in meetings and collaborate to meet daily production goals.
• Maintain a neat, orderly workspace and work 8 hours under a microscope.
• Communicate effectively in English and read work instructions.
• Perform equipment setup and calibration; assist with maintenance as needed.
• Collaborate with Process and Quality Engineering to troubleshoot procedures.

Skills

wire bonding

gap welding

eutectic die attach

epoxy attach

tweezer under microscope

Tools

Automated assembly equipment

Job description

Honeywell Aerospace is seeking a skilled assembler to impact production line efficiency and quality, ensuring correct assembly and conformance to specifications. You will work with microelectronic, RF, and semiconductor components, using wire bonding, die attach, and other precision techniques, often under a microscope.

Responsibilities include equipment setup, calibration, and collaboration with Process and Quality Engineering to resolve procedure challenges. A U.S.