Senior Mechanical Engineer - High-Power Electronics

GE Vernova, Inc.

Findlay Township, Northern (PA, KY)

Hybrid

USD 113,000 - 189,000

Full time

14 days+
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Benefits offered by this job

Relocation assistance
Comprehensive benefits package
401(k) matching contributions

Job summary

GE Vernova is seeking a Senior Mechanical Engineer to lead packaging, structural, and thermal design for high‑power electrical systems. You will develop cooling systems, enclosures, and architectures for power electronics operating in demanding environments.

You will mentor junior engineers and apply FEA/CFD, rapid prototyping, and testing to validate designs for energy storage, propulsion, and naval power applications, including SiC/GaN devices.

Qualifications

  • Bachelors or higher in mechanical engineering with emphasis on electrical system design.
  • 6+ years in electrical engineering or power electronics packaging.
  • 3+ years with 3D CAD tools and simulation software.
  • Experience with electronics packaging for VFDs and power components.

Responsibilities

  • Review customer requirements and develop mechanical/thermal specs for high‑power converter systems.
  • Lead system architecture and packaging design trade studies.
  • Own thermal management strategy including heat sinks and cold plates.
  • Perform and guide FEA/CFD modeling for cooling, structure, and vibration.
  • Develop cooling loop hardware and validate with testing and simulation.
  • Design rugged enclosures, busbars, connectors, and PCB mounting for harsh environments.
  • Ensure HV safety, creepage/clearance, EMI, and environmental compliance.
  • Drive DFM/DFA, manage BOMs, and support manufacturing and supply chain.

Skills

Mechanical design
Thermal design
Mentoring
Power electronics packaging

Education

Engineering degree in Mechanical Engineering

Tools

Windchill/Creo
ANSYS Workbench
ANSYS Electronics Desktop
COMSOL
ANSYS Mechanical
Fluent

Job description

GE Vernova is seeking a Senior Mechanical Engineer to lead packaging, structural, and thermal design for high‑power electrical systems. You will develop cooling systems, enclosures, and architectures for power electronics operating in demanding environments.

You will mentor junior engineers and apply FEA/CFD, rapid prototyping, and testing to validate designs for energy storage, propulsion, and naval power applications, including SiC/GaN devices.

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