Senior Mechanical Engineer, Avionics Packaging

Harris Geospatial Solutions; Palm Bay (FL); On-site; USD 90,000 - 115,000; Full time

Job summary

L3Harris Technologies in Palm Bay, FL is seeking an Electronic Packaging / Mechanical Engineer to join a cross-functional team. You will guide the mechanical design from concept through hardware integration and testing, interfacing with Designers, Analysts, and Systems Engineers to meet stringent avionics requirements.

The role emphasizes packaging electronics for rugged environments, designing for manufacturability, and obtaining US government clearance.

Qualifications

• Bachelor’s degree and 2+ years of related experience, or advanced degree with up to 2 years.
• Experience with avionics packaging and mechanical design for rugged environments.
• Strong CAD skills in Creo, Catia, NX, or SolidWorks.

Responsibilities

• Develop complex mechanical designs and layouts for multiple products.
• Collaborate with cross-functional teams for new solutions.
• Analyze thermal, structural, and electro-mechanical aspects.
• Package electronics including connectors and cables for rugged environments.
• Source parts and interact with vendors; support design control docs.

Skills

Mechanical design

Requirements analysis

3D CAD modeling

Documentation

DFM/DFMA

Machined parts

Sheet metal parts

Military env testing

ASME Y14.5

GD&T

CAD software

Education

Bachelor’s degree

Graduate degree

Tools

PTC Creo

Catia

NX

SolidWorks

Job description

L3Harris Technologies in Palm Bay, FL is seeking an Electronic Packaging / Mechanical Engineer to join a cross-functional team. You will guide the mechanical design from concept through hardware integration and testing, interfacing with Designers, Analysts, and Systems Engineers to meet stringent avionics requirements.

The role emphasizes packaging electronics for rugged environments, designing for manufacturability, and obtaining US government clearance.