Avionics Thermal Analyst - Mechanical Packaging

Harris Geospatial Solutions; Palm Bay (FL); On-site; USD 90,000 - 120,000; Full time

Job summary

L3Harris Technologies is seeking an Electronics Packaging Mechanical Engineer specializing in thermal analysis for avionics systems in Palm Bay, FL. The role covers the full lifecycle from concept to hardware integration, with emphasis on first-order thermodynamics and CFD simulations to predict thermal behavior.

The candidate will collaborate with design, thermal/structural analysis, and systems engineering teams, contributing to design, analysis, documentation, fabrication, and qualification

Qualifications

• Bachelors degree in engineering with 4+ years of related experience.
• Graduate degree with 2+ years of related experience acceptable.
• Experience in CFD software and thermal analysis for electronics packaging.
• Experience with 3D CAD tools is preferred.
• Ability to obtain US government security clearance.

Responsibilities

• Perform thermal analysis of avionics electronics packaging from concept to hardware integration.
• Use CFD methods to predict system and component thermal responses.
• Collaborate with designers, systems engineers and other disciplines.
• Support thermal qualification testing and documentation.

Skills

Thermal analysis

CFD software

Electronics packaging

CAD modeling

Team collaboration

Education

Bachelor’s Degree

Graduate Degree

Tools

FloTHERM

Ansys

Icepak

StarCCM

OpenFOAM

PTC Creo

Job description

L3Harris Technologies is seeking an Electronics Packaging Mechanical Engineer specializing in thermal analysis for avionics systems in Palm Bay, FL. The role covers the full lifecycle from concept to hardware integration, with emphasis on first-order thermodynamics and CFD simulations to predict thermal behavior.

The candidate will collaborate with design, thermal/structural analysis, and systems engineering teams, contributing to design, analysis, documentation, fabrication, and qualification