Senior HV Packaging Engineer - High-Power Modules & GaN/SiC

Texas Instruments; United States; Remote; USD 120,000 - 150,000; Full time

Benefits offered by this job

Competitive pay

Comprehensive benefits package

Job summary

Texas Instruments is seeking a senior packaging engineer to define, design, and scale high voltage (200-3300V) packages and modules for various markets including Industrial and Automotive. The role requires a Master's degree in a relevant field and more than 8 years of experience in high voltage semiconductor packaging.

Applicants should have proven leadership capabilities and a solid understanding of the materials landscape for high voltage applications. Competitive compensation and benefits are offered.

Qualifications

• 8+ years of experience in high voltage semiconductor packaging.
• Hands-on experience in package design and integration.
• Strong understanding of materials for high voltage applications.

Responsibilities

• Define and develop high voltage packages and modules.
• Create reliability plans and summarize failure modes.
• Collaborate with cross-functional teams for rapid development.

Skills

High Voltage Packaging

Leadership

Thermal and Electrical Modeling

Communication Skills

Education

Master’s degree in Mechanical Engineering, Materials Science, Electrical Engineering or related engineering degree

Tools

CFD Tools

Stress Analysis Tools

Job description

Texas Instruments is seeking a senior packaging engineer to define, design, and scale high voltage (200-3300V) packages and modules for various markets including Industrial and Automotive. The role requires a Master's degree in a relevant field and more than 8 years of experience in high voltage semiconductor packaging.

Applicants should have proven leadership capabilities and a solid understanding of the materials landscape for high voltage applications. Competitive compensation and benefits are offered.