Senior High-Density PCB Designer — Onsite Austin

Qualcomm Incorporated

Austin (TX)

On-site

USD 79,000 - 119,000

Full time

13 days ago

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Job summary

Qualcomm Technologies, Inc. is seeking a Staff PCB Designer to shape next-generation hardware from concept through fabrication.

You will design high-density PCB layouts for Data Center, Server, Connectivity, and Compute platforms, collaborating with global engineering teams to meet strict manufacturing standards and project schedules. Senior role requires extensive experience with RF, high-speed digital circuits, and DFM practices.

Qualifications

  • 5+ years of experience in PCB design for high-density electronics packaging
  • Experience designing consumer-grade mobile products or low-volume test products using latest-generation processor chips and ICs
  • Proficiency with PCB design software (Siemens/Mentor Xpedition, PADS, Altium, Cadence Allegro)
  • Associate degree in Electronics, Electrical Technology, or related technical field
  • Strong collaboration and communication skills

Responsibilities

  • Design and document high-density PCB layouts per schematics and constraints
  • Develop PCB layouts for Data Center, Server, Connectivity designs
  • Support test platforms with RF, high-speed digital circuits, and power control devices
  • Collaborate with US/India teams to deliver PCB design solutions
  • Prepare and deliver design reviews to project teams
  • Contribute to process improvements and PCB DFMs

Skills

PCB design
Cross-functional collaboration
Verbal communication
Leadership
Project management

Education

Associate degree in Electronics / Electrical Technology
Bachelor’s degree in electrical engineering / electronics engineering technology

Tools

Siemens/Mentor Xpedition
PADS
Altium
Cadence Allegro

Job description

Qualcomm Technologies, Inc. is seeking a Staff PCB Designer to shape next-generation hardware from concept through fabrication.

You will design high-density PCB layouts for Data Center, Server, Connectivity, and Compute platforms, collaborating with global engineering teams to meet strict manufacturing standards and project schedules. Senior role requires extensive experience with RF, high-speed digital circuits, and DFM practices.

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