Senior Hardware Design Engineer – High-Speed PCB & Bring-Up

GCS Recruitment; Seattle (WA); On-site; USD 130,000 - 170,000; Full time

Job summary

GCS Recruitment is seeking a Hardware Design Engineer or PCB Engineer in Seattle to lead board development for advanced phased-array antenna electronics.

You will own lab bring-up, verification and collaboration with design teams for next-generation high-density, multi-layer PCBs and high-speed interfaces, using oscilloscopes, logic analyzers, and test equipment. A Bachelor's or Master's in EE is required.

Qualifications

• Bachelor's or Master's degree in Electrical Engineering or equivalent industry experience.
• 8+ years of board-level electrical design experience including schematic capture and complex multilayer PCB design.
• Experience with power distribution and sequencing, and with high-speed digital interfaces.

Responsibilities

• Lead bring-up of newly fabricated boards, including power-on testing, subsystem checkout, debugging, and root-cause analysis.
• Plan and execute design verification and validation activities, including high-speed digital testing and power characterization, with documentation to engineering standards.
• Collaborate with design engineers to identify issues and implement improvements in future revisions.
• Contribute to schematic capture and PCB layout activities for next-generation hardware designs.
• Support downstream integration and testing teams by delivering validated hardware and assisting with measurement and debug activities.

Skills

Board-level design

Schematic capture

Multilayer PCB

Power integrity

Signal integrity

High-speed testing

Lab debugging

Education

Bachelor's or Master's degree in Electrical Engineering

Tools

Oscilloscopes

Logic analyzers

Protocol analyzers

High-speed test equipment

Python scripting

Job description

GCS Recruitment is seeking a Hardware Design Engineer or PCB Engineer in Seattle to lead board development for advanced phased-array antenna electronics.

You will own lab bring-up, verification and collaboration with design teams for next-generation high-density, multi-layer PCBs and high-speed interfaces, using oscilloscopes, logic analyzers, and test equipment. A Bachelor's or Master's in EE is required.