Senior Engineer, Advanced DRAM & Memory Architectures

1000 Micron Technology, Inc.; Boise (ID); On-site; USD 120,000 - 160,000; Full time

Benefits offered by this job

Medical, dental, and vision plans

Paid time off

Paid family leave

Job summary

1000 Micron Technology, Inc. seeks an experienced professional to lead technology integration and develop new device architectures for layered memory devices in Boise, Idaho.

The successful candidate will have a MS or PhD and over 10 years in semiconductor process integration, focusing on optimizing process flows and implementing solutions. Comprehensive benefits, including medical and paid time off, are offered.

Qualifications

• 10+ years of relevant industry experience in semiconductor process integration or advanced node development.
• Strong functional knowledge of semiconductor device physics and meticulous experiment design.

Responsibilities

• Lead technology integration activities for layered memory devices.
• Develop and integrate new device architectures.
• Analyze inline, defect, and parametric data for yield improvement.

Skills

Semiconductor process integration

Device physics knowledge

Project management

Experiment design

Education

MS or PhD in Physics, Materials Science, Electrical Engineering

Job description

1000 Micron Technology, Inc. seeks an experienced professional to lead technology integration and develop new device architectures for layered memory devices in Boise, Idaho.

The successful candidate will have a MS or PhD and over 10 years in semiconductor process integration, focusing on optimizing process flows and implementing solutions. Comprehensive benefits, including medical and paid time off, are offered.