Senior Electroplating Engineering Lead

3D Glass Solutions, Inc-; Albuquerque (NM); On-site; USD 120,000 - 180,000; Full time

Job summary

3D Glass Solutions, Inc- is seeking an Electroplate Team Leader who brings deep expertise in back-end thick Cu (Bump) integration, photolithography, electroplating, spin-on dielectrics, and laminate films. The role requires leading teams and advanced project management to scale from R&D to high-volume manufacturing.

The selected candidate will have visibility to executive management and contribute to continuous improvement, quality, yields, and cost reductions across manufacturing processes

Qualifications

• Bachelor of Science in Engineering is required.
• 10+ years of semiconductor manufacturing experience with thick Cu (bump) integration.

Responsibilities

• Provide technical expertise in electroplating and lead R&D to expand capabilities.
• Lead efforts for dicing, etch, and solder ball attach.
• Support manufacturing continuous improvement and improve processes and systems.
• Determine root causes using statistical methods and DOE to drive design and processing changes.
• Maintain reliable, safe, and cost-efficient manufacturing operations.
• Collaborate with external companies and universities on R&D for integration improvements.

Skills

Team leadership

Executive presentation

Process improvement

Statistical problem solving

Education

Bachelor of Science in Engineering

Job description

3D Glass Solutions, Inc- is seeking an Electroplate Team Leader who brings deep expertise in back-end thick Cu (Bump) integration, photolithography, electroplating, spin-on dielectrics, and laminate films. The role requires leading teams and advanced project management to scale from R&D to high-volume manufacturing.

The selected candidate will have visibility to executive management and contribute to continuous improvement, quality, yields, and cost reductions across manufacturing processes