Senior Electromagnetic Engineer: High-Q Wireless Power

Neolife Updates

New York (NY)

On-site

USD 120,000 - 170,000

Full time

13 days ago

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Benefits offered by this job

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Job summary

Yank Technologies, Inc. in Brooklyn, NY, seeks an Electromagnetic Engineer to lead the design and optimization of magnetic structures for near-field wireless power transfer. You will work on high-Q resonant coils and hybrid magnetic systems in a startup setting.

The role focuses on bridging electromagnetic theory with practical implementation, addressing skin and proximity effects, EMI/EMC considerations, and materials selection for compact integration.

Qualifications

  • MS in EE or related field required; PhD preferred for leadership roles.
  • 3+ years in magnetics design or wireless power.
  • Experience with high-Q coil architectures and planar magnetics.

Responsibilities

  • Design and optimize high-Q resonant coil systems for wireless power transfer in the 6.78 MHz range or similar.
  • Develop magnetic structures including inductors, transformers, and shielding for high power density systems.
  • Perform EM analysis focusing on coupling, parasitics, losses, thermal effects, and efficiency.
  • Collaborate with power electronics engineers on system-level integration.
  • Prototype, test, and validate magnetic components and wireless power assemblies.

Skills

High-frequency magnetics
Coil design & optimization
EM modeling
Hardware debugging
Technical communication

Education

Master's Degree in Electrical Engineering
PhD in Electrical Engineering (preferred)

Tools

Ansys Maxwell
CST Studio Suite

Job description

Yank Technologies, Inc. in Brooklyn, NY, seeks an Electromagnetic Engineer to lead the design and optimization of magnetic structures for near-field wireless power transfer. You will work on high-Q resonant coils and hybrid magnetic systems in a startup setting.

The role focuses on bridging electromagnetic theory with practical implementation, addressing skin and proximity effects, EMI/EMC considerations, and materials selection for compact integration.

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