Senior Dry-Etch Process Engineer

Actalent; Beaverton (OR); On-site; USD 100,000 - 160,000; Full time

Benefits offered by this job

Bonus program

Job summary

Actalent in Hillsboro, OR is seeking a Process Engineer to join either the Process Development or Defects & Productivity teams, with current focus on Process Development. The role involves running experiments, reporting results, and DOE-driven tuning to optimize dry etch processes for future production.

You'll collaborate with Process Technicians and the Analytical Team in a clean room environment and work on advanced nodes (2nm, 14A, 10A and beyond) in FEOL/BEOL dry etch modules.

Qualifications

• 6+ years in dry etch/plasma etch processes in semiconductor manufacturing.
• 5–15 years as a Process Engineer in semiconductor manufacturing.
• Proficient in process improvement, manufacturing engineering, tooling, thin film, and SPC.
• Experience in deposition and lithography; clean room experience.

Responsibilities

• Conduct experiments for customer projects and provide detailed reports and presentations regularly.
• Support the development of advanced dry etch processes to achieve customer tool-of-record selections.
• Execute process development, optimization, and DOE-driven tuning to meet customer specifications, performance targets, and device integration requirements.
• Collaborate with Process Technicians and Analytical Team members on the process development cycle.
• Work on advanced process nodes (2nm, 14A, 10A, and beyond) in FEOL and BEOL dry etch modules.

Skills

Dry etch / plasma etch

Process improvement

Manufacturing engineering

SPC

Thin film

Experimental processes

Job description

Actalent in Hillsboro, OR is seeking a Process Engineer to join either the Process Development or Defects & Productivity teams, with current focus on Process Development. The role involves running experiments, reporting results, and DOE-driven tuning to optimize dry etch processes for future production.

You'll collaborate with Process Technicians and the Analytical Team in a clean room environment and work on advanced nodes (2nm, 14A, 10A and beyond) in FEOL/BEOL dry etch modules.