Senior Avionics Mechanical Engineer

Harris Geospatial Solutions; Palm Bay (FL); On-site; USD 90,000 - 120,000; Full time

Job summary

L3Harris Technologies is seeking an Electronic Packaging / Mechanical Engineer to advance avionics systems from concept to hardware integration and testing. You will collaborate with Designers, Thermal/Structural Analysts, Systems Engineers, and Program Managers to deliver mechanical solutions that meet stringent requirements.

The role emphasizes leading designs, prototyping, testing, and validation of electronic packaging for avionics platforms in rugged environments, with opportunities to

Qualifications

• Bachelor’s Degree in engineering and minimum 6 years of prior relevant experience; Graduate Degree with 4+ years preferred.
• Experience in mechanical design, requirements analysis, interface definition, and design for manufacturability.

Responsibilities

• Work with cross-functional teams to develop avionics-focused mechanical designs.
• Perform thermal, structural, fluid, and power analyses to guide design decisions.
• Create complex mechanical layouts for multiple products and validate rugged environments.
• Package electronics including design for and testing to military environments (temperature, vibration, shock).
• Lead mechanical design, prototyping, testing, and troubleshooting of designs.
• Develop and maintain design control documentation and interface with vendors.

Skills

Mechanical design

Thermal analysis

Cross-functional team

3D CAD modeling

Education

Bachelor’s Degree in engineering

Graduate degree

Tools

PTC Creo

Catia

NX

SolidWorks

Job description

L3Harris Technologies is seeking an Electronic Packaging / Mechanical Engineer to advance avionics systems from concept to hardware integration and testing. You will collaborate with Designers, Thermal/Structural Analysts, Systems Engineers, and Program Managers to deliver mechanical solutions that meet stringent requirements.

The role emphasizes leading designs, prototyping, testing, and validation of electronic packaging for avionics platforms in rugged environments, with opportunities to