Senior 3D NAND Process Integration Engineer

Solidigm; California (MO); On-site; USD 167,440 - 268,000; Full time

Job summary

Solidigm is seeking a Senior Process Integration Engineer for 3D NAND technology development to enable a future high-capacity data storage roadmap.

You will lead and drive next generation NAND process technology qualification, ensuring performance, reliability, and yield, and transfer technologies to high-volume manufacturing in collaboration with Device, Product Engineering, Design, and QA teams.

Qualifications

• MS or PhD in Electrical Engineering or Materials Science with 10+ years in semiconductor processing.
• Leadership to enroll multidisciplinary teams for project management.
• Technical breadth in semiconductor processing techniques and device physics.
• Strong analytical and problem-solving skills with attention to detail.
• Ability to work in a collaborative team environment and manage multiple projects.

Responsibilities

• Define process flow and target specs to meet customer product requirements.
• Lead a multidisciplinary team of process, device, manufacturing, reliability, and design engineers for PRQ and manufacturing transfer.
• Identify and resolve process-related issues using model-based problem solving.
• Use statistical tools to draw conclusions and drive data-driven decisions to improve performance, reliability, and yield.
• Drive continuous improvement initiatives to enhance performance, reliability, and yield cost-effectively.
• Collaborate with cross-functional teams to develop, optimize, and troubleshoot semiconductor manufacturing processes and transfer new technologies into high-volume production.

Skills

Process integration

Semiconductor processing

Statistical analysis

Problem solving

Team leadership

Communication skills

Education

MS/PhD Electrical Engineering

Materials Science

Job description

Solidigm is seeking a Senior Process Integration Engineer for 3D NAND technology development to enable a future high-capacity data storage roadmap.

You will lead and drive next generation NAND process technology qualification, ensuring performance, reliability, and yield, and transfer technologies to high-volume manufacturing in collaboration with Device, Product Engineering, Design, and QA teams.