Semiconductor Process Support Engineer II Dallas

Applied Materials, Inc.; Richardson (TX); On-site; USD 87,000 - 119,000; Full time

Benefits offered by this job

Bonus eligibility

Stock award program

Relocation assistance

Job summary

Applied Materials, Inc. in Dallas–Richardson, TX seeks a Process Support Engineer to guide products through their lifecycle, provide high-visibility customer support, and collaborate with R&D to develop advanced semiconductor processes.

The role involves on-site installations, diagnostics, service and repair of complex systems, DOE development, data analysis, and cross-functional problem solving with engineering and product teams. Travel up to 20% is expected.

Qualifications

• Minimum 4 years in Semiconductor Capital Equipment or similar high-tech industry.
• Preferred 2+ years in Applications or Process Engineering, Bachelor’s Degree in STEM.
• Location: Dallas–Richardson, TX (on-site).

Responsibilities

• Serves as liaison between the customer and the Business Unit for assigned projects, ensuring clear understanding of customer issues and delivery of applicable solutions.
• When necessary, works closely with customer to optimize tool performance to meet customer process and integration requirements.
• Checks and approves operational quality of system equipment.
• Instructs customers in the operation and maintenance of the system.
• Provides highly visible customer support through on-site installation, as well as overseeing any necessary diagnoses, troubleshooting, service, and repair of complex equipment and systems.
• Knowledge of 3 or more processes on 1 or more technologies

Skills

Semiconductor equipment

Process engineering

Education

Bachelor’s degree in STEM field

Job description

Applied Materials, Inc. in Dallas–Richardson, TX seeks a Process Support Engineer to guide products through their lifecycle, provide high-visibility customer support, and collaborate with R&D to develop advanced semiconductor processes.

The role involves on-site installations, diagnostics, service and repair of complex systems, DOE development, data analysis, and cross-functional problem solving with engineering and product teams. Travel up to 20% is expected.