Semiconductor Process Specialist – 12-Hour Shifts

MACOM; Lowell (MA); On-site; USD 51,000 - 69,000; Full time

Benefits offered by this job

Health, dental, and vision coverage

401(k) plan

Paid time off

Professional development opportunities

Job summary

MACOM in Lowell, MA is seeking a Shift Engineering Specialist to join our semiconductor manufacturing floor. You will set up, operate, and monitor fabrication equipment across multiple processes to ensure quality products are produced.

Ideal candidates have a Bachelor’s degree in Engineering, Materials Science, or Physics; Master’s preferred, 0–3 years in thin film processing, and experience with FIB, RIE, PECVD, IBE, and SEM/FIB.

Qualifications

• Bachelor's degree in Engineering, Materials Science or Physics; master’s preferred.
• 0–3 years in process development and manufacturing, thin film processing.
• Hands-on with FIB, RIE, RIE/ICP/CAIBE, PECVD, IBE and SEM/FIB.
• Strong analytical capacity, diagnostic ability and communication skills.

Responsibilities

• Set up, operate, load, and monitor fabrication equipment to ensure quality products.
• Provide technical support to wafer fab operations and drive process improvements in safety, quality and output.
• Work across multiple process technologies including thin films, photolithography, diffusion/implant, metrology, and wet/dry etch.
• Record data and assist with troubleshooting and yield analysis.

Skills

Analytical skills

Strong communication skills

Attention to detail

Multi-tasking

Education

Bachelor's degree in Engineering, Materials Science, or Physics

Master’s degree preferred

Tools

Python

SQL

JMP

FIB

RIE

PECVD

IBE

SEM/FIB

RIE/ICP/CAIBE

Job description

MACOM in Lowell, MA is seeking a Shift Engineering Specialist to join our semiconductor manufacturing floor. You will set up, operate, and monitor fabrication equipment across multiple processes to ensure quality products are produced.

Ideal candidates have a Bachelor’s degree in Engineering, Materials Science, or Physics; Master’s preferred, 0–3 years in thin film processing, and experience with FIB, RIE, PECVD, IBE, and SEM/FIB.