Semiconductor Process Engineer for InP Laser Fabrication

Glint Tech Solutions LLC; SOUTH PLAINFIELD (NJ); On-site; USD 95,000 - 130,000; Full time

Job summary

Glint Tech Solutions LLC, on behalf of a semiconductor industry client, seeks a Process Engineer to support InP BH laser wafer fabrication. You will work across photolithography, etching, film deposition, wafer cleaning, metrology, and process control to advance yield and device performance.

Requirements include an M.S./Ph.D. in a technical field and 1–3 years fab experience with hands-on lithography, etching, and cleaning; familiarity with SEM/EDS/ellipsometry/profilometry; and ability to

Qualifications

• MS or PhD in a technical field and semiconductor fab experience preferred.
• Hands-on experience with photolithography, etching, and wafer cleaning.

Responsibilities

• Support InP BH laser wafer fabrication processes
• Work across photolithography, holographic grating, film deposition, dry/wet etching, and wafer cleaning
• Monitor manufacturing processes through SPC and other process-control methods
• Troubleshoot fabrication and process issues, driving continuous yield improvements
• Partner with device design engineers on DOE and new process development
• Develop metrology methods to characterize wafer processes
• Analyze process data and prepare engineering reports
• Support process equipment maintenance and coordinate with suppliers
• Develop work instructions and provide technical training to production technicians

Skills

Photolithography

Etching

Wafer cleaning

Process control

SPC

DOE

Education

M.S. or Ph.D. in Electrical Engineering, Materials Science, Chemistry, Mechanical Engineering, or related field

Tools

SEM

EDS

Ellipsometer

Profilometer

Job description

Glint Tech Solutions LLC, on behalf of a semiconductor industry client, seeks a Process Engineer to support InP BH laser wafer fabrication. You will work across photolithography, etching, film deposition, wafer cleaning, metrology, and process control to advance yield and device performance.

Requirements include an M.S./Ph.D. in a technical field and 1–3 years fab experience with hands-on lithography, etching, and cleaning; familiarity with SEM/EDS/ellipsometry/profilometry; and ability to