Semiconductor Module Engineering PhD Intern

Intel Corporation; Hillsboro (OR); On-site; USD 121,000 - 122,000; Full time

Benefits offered by this job

Stock bonuses

Health benefits

Vacation

Job summary

Intel Corporation in Hillsboro, Oregon is offering a Module Engineering Intern position within the F25 Metals organization. You will work with engineers and operations teams to support HVM and own a meaningful project focusing on process improvement, equipment performance, data analytics, or automation.

Interns will participate in day-to-day engineering activities, engage with cross-functional stakeholders, and learn how engineering decisions are made in a high-volume manufacturing environment.

Qualifications

• Enrolled as a PhD student in a technical field (EE, Chemical Eng, Materials Sci, Physics or related).
• GPA minimum 3.0.
• Experience in semiconductor processing or related fields is preferred (academic/research/internship).

Responsibilities

• Lead a project from definition through execution and final presentation.
• Analyze manufacturing, equipment and operational data to support decisions.
• Apply structured problem-solving and continuous improvement methods.

Skills

Python

JMP

MATLAB

Power BI

Excel

SQL

Data analytics

Problem solving

Education

Pursuing PhD in Electrical/Chemical/Materials Science/Physics

Minimum GPA 3.0

Tools

JMP

MATLAB

Python

Power BI

Excel

SQL

Job description

Intel Corporation in Hillsboro, Oregon is offering a Module Engineering Intern position within the F25 Metals organization. You will work with engineers and operations teams to support HVM and own a meaningful project focusing on process improvement, equipment performance, data analytics, or automation.

Interns will participate in day-to-day engineering activities, engage with cross-functional stakeholders, and learn how engineering decisions are made in a high-volume manufacturing environment.