Semiconductor Assembly Operator

heico; Sunnyvale (CA); On-site; USD 90,000 - 130,000; Full time

Benefits offered by this job

Medical plans (BCBS and Kaiser)

401(k) with employer match

Sick and Vacation time

HSA with company contributions

Job summary

Pyramid Semiconductor, part of the HEICO group, is seeking a Semiconductor Assembly Operator to perform die attach and operate wire bonding equipment on ceramic packages. The role may involve training in visual inspection, burn-in, testing, and other duties as needed.

Responsibilities include die attach, wire bonding with manual and automated bonders, sealing devices with lids, and coordinating assembly tasks for optimal performance. A cleanroom environment familiarity is essential.

Qualifications

• High school diploma or equivalent.
• 5+ years of experience in a semiconductor manufacturing environment, including wire bonding.
• Ability to work in a cleanroom environment.
• Ability to follow instructions, work in a team environment, and assist where needed.

Responsibilities

• Performs die attach of die to various packages.
• Performs wire bonding of the devices using the manual and automated bonders
• Clip the devices with lids and performs sealing of the devices.
• Coordinates various tasks in assembly for optimum performance.

Skills

Wire bonding experience

Cleanroom

Education

High school diploma or equivalent

Job description

Pyramid Semiconductor, part of the HEICO group (www.heico.com, NYSE HEI), is a manufacturer of semiconductors components. Pyramid Semiconductor is a complete semiconductor integrated circuit designer and manufacturer. We provide our customers with high reliability parts for their legacy programs.

We are currently looking for a Semiconductor Assembly Operator to join our team. The primary responsibility of this position is to perform die attach and operate a wire bonding machine to wire silicon dice on ceramic packages. Additionally, based on the manufacturing needs, the person will be trained in different positions such as visual inspection, burn-in, testing, and other duties as assigned.

Main responsibilities:

• Performs die attach of die to various packages.
• Performs wire bonding of the devices using the manual and automated bonders
• Clip the devices with lids and performs sealing of the devices.
• Coordinates various tasks in assembly for optimum performance.

Key qualifications:

• High school diploma or equivalent required.
• 5+ years of experience in a semiconductor manufacturing environment, including wire bonding.
• Ability to work in a cleanroom environment.
• Ability to follow instructions, work in a team environment, and assist where needed.

Compensation and benefits:

BCBS and Kaiser medical plans with different options

• Dental and vision plans
• 401(k) with employer match
• Sick and Vacation time
• Health Savings Account (HSA) with Company Contributions

And more

We are committed to providing our employees with opportunities for growth and development.