Semiconductor Assembly Operator

Wencor Group; Sunnyvale (CA); Hybrid; USD 39,000 - 41,000; Full time

Benefits offered by this job

Medical plans (BCBS/Kaiser)

Dental & vision plans

401(k) with employer match

Sick & Vacation time

HSA contributions

Job summary

Pyramid Semiconductor, part of HEICO, is seeking a Semiconductor Assembly Operator to perform die attach and wire silicon dice on ceramic packages. The role includes training in related tasks such as visual inspection, burn-in, and testing to support manufacturing needs.

Responsibilities include wire bonding with manual/automatic bonders, clipping devices with lids, and coordinating assembly tasks for optimal performance.

Qualifications

• High school diploma or equivalent.
• 5+ years of experience in a semiconductor manufacturing environment, including wire bonding.
• Ability to work in a cleanroom environment.
• Ability to follow instructions, work in a team environment, and assist where needed.

Responsibilities

• Performs wire bonding of the devices using the manual and automated bonders.
• Clip the devices with lids and performs sealing of the devices.
• Coordinates various tasks in assembly for optimum performance.

Skills

Wire bonding

Cleanroom operations

Instruction following

Team collaboration

Education

High school diploma

Tools

Bonding machines

Manual/automatic bonders

Job description

Pyramid Semiconductor, part of the HEICO group (www.heico.com, NYSE HEI), is a manufacturer of semiconductors components. Pyramid Semiconductor is a complete semiconductor integrated circuit designer and manufacturer. We provide our customers with high reliability parts for their legacy programs.

We are currently looking for a Semiconductor Assembly Operator to join our team. The primary responsibility of this position is to perform die attach and operate a wire bonding machine to wire silicon dice on ceramic packages. Additionally, based on the manufacturing needs, the person will be trained in different positions such as visual inspection, burn-in, testing, and other duties as assigned.

Main responsibilities :

• Performs wire bonding of the devices using the manual and automated bonders
• Clip the devices with lids and performs sealing of the devices.
• Coordinates various tasks in assembly for optimum performance.

Requirements

• High school diploma or equivalent required.
• 5+ years of experience in a semiconductor manufacturing environment, including wire bonding.
• Ability to work in a cleanroom environment.
• Ability to follow instructions, work in a team environment, and assist where needed.

Compensation and benefits:

BCBS and Kaiser medical plans with different options

• Dental and vision plans
• 401(k) with employer match
• Sick and Vacation time
• Health Savings Account (HSA) with Company Contributions

We are committed to providing our employees with opportunities for growth and development.

Pay Range

Pay Range

The estimated pay range for this job. Disclosing pay information promotes competitive and equitable pay.
The actual pay rate will depend on the person's qualifications and experience. $28.00 - $30.00 / hour

Pay Transparency

In order to support the Fair Compensation Strategy by the US Govt., HR Dept., clients are required to adhere to "Pay Transparency Law"; in the impacted states; that have mandated the employers to list the salary ranges in Job advertisements or postings for job opportunities and Job promotions.

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