Second-Shift Microelectronic Wire Bonding Technician

Lockheed Martin Corporation; Chelmsford (MA); On-site; USD 47,000 - 88,000; Full time

Benefits offered by this job

Medical

Dental

Vision

401(k) match

Paid time off

Flexible work arrangements

Job summary

Lockheed Martin Missiles & Fire Control in Chelmsford, MA seeks a Microelectronic Bonder to perform high-precision wire-bonding and fabrication of hybrid microcircuits. The role supports critical defense systems and requires U.S. citizenship and ability to obtain a Secret clearance.

You will work on complex sub-assemblies, using specialized equipment and following strict procedures to ensure reliability in mission-critical hardware. Chelmsford location, full-time on-site.

Qualifications

• Ability to work 10 hours under a microscope with hand tools.
• Good dexterity and eye/hand coordination.
• Experience in wirebonding and/or ribbon bonding.
• Experience in microelectronics assembly.
• Ability to obtain a Secret clearance; must be a U.S. citizen.

Responsibilities

• Execute high-precision wire-bonding and hybrid circuit fabrication tasks.
• Perform fabrication of hybrid microcircuits and sub-assemblies.
• Troubleshoot defective hybrids using visual or mechanical methods.

Skills

Wirebonding

Teamwork

Reading drawings

Dexterity

Tools

Westbond

Metcal bonding machine

Unitech welder

Job description

Lockheed Martin Missiles & Fire Control in Chelmsford, MA seeks a Microelectronic Bonder to perform high-precision wire-bonding and fabrication of hybrid microcircuits. The role supports critical defense systems and requires U.S. citizenship and ability to obtain a Secret clearance.

You will work on complex sub-assemblies, using specialized equipment and following strict procedures to ensure reliability in mission-critical hardware. Chelmsford location, full-time on-site.