Assembler - Weekend Shift

Lockheed Martin Corporation; Chelmsford (MA); Presencial; USD 47 000 - 88 000; Tempo integral

Vantagens oferecidas por esta oferta de emprego

Medical insurance

Dental insurance

Vision insurance

Flexible work arrangements (e.g., 4x10

401(k) match

Paid time off

Holidays

Parental Leave

Employee Assistance Program (EAP)

Flexible Spending Accounts

Education Assistance

Life Insurance

Short-Term Disability

Long-Term Disability

Resumo da oferta

You will be the Microelectronic Bonder for Lockheed Martin Missiles & Fire Control in Chelmsford, MA for our weekend shift. Our team is responsible for fabricating and modifying hybrid microcircuits and sub‑assemblies that support critical defense systems. The role requires high-precision wire-bonding, hybrid circuit fabrication, and the ability to troubleshoot defects.

A Secret clearance and U.S. citizenship are required, with potential for career growth in a fast-paced, mission-driven

Qualificações

• High school diploma or GED required.
• Ability to obtain and maintain a Secret security clearance, which requires U.S. citizenship.

Responsabilidades

• Execute high-precision wire-bonding and hybrid circuit fabrication tasks.
• Perform fabrication of hybrid microcircuits and sub-assemblies.
• Troubleshoot defective hybrids by visual or mechanical screening and wirebonds.

Conhecimentos

Bonding microelectronics

Gold ball bonding

Ribbon bonding

Basic computer skills

Attention to detail

Instruction following

J-STD-001 IPC-A-610

ESD procedures

Formação académica

High school diploma or GED

Ferramentas

Manual bonding equipment

Automatic bonding equipment

Ohmmeter

Digital timekeeping systems

Descrição da oferta de emprego

Standard Job Description

Performs fabrication or modification tasks on hybrid microcircuits and sub-assemblies. Performs fabrication of hybrid microcircuits; e.g., aluminum and gold wirebonding under conditions such as small pad sizes down to .001 inch squares, very high semiconductor chip density, unusual substrate configurations which require special setup and bonding techniques. Requires the capability to troubleshoot defective hybrids by visual or mechanical screening, wirebonds or chip placement. Electrically troubleshoots hybrid circuitry using an ohmmeter. Performs final assembly operations including attachment of feedthrough pins, soldering of coils, and mounting of substrates in special non-standard packages. Performs thick film screen, dry, and fire operations of various types.

Standard Job Description

Performs fabrication or modification tasks on hybrid microcircuits and sub-assemblies. Performs fabrication of hybrid microcircuits; e.g., aluminum and gold wirebonding under conditions such as small pad sizes down to .001 inch squares, very high semiconductor chip density, unusual substrate configurations which require special setup and bonding techniques. Requires the capability to troubleshoot defective hybrids by visual or mechanical screening, wirebonds or chip placement. Electrically troubleshoots hybrid circuitry using an ohmmeter. Performs final assembly operations including attachment of feedthrough pins, soldering of coils, and mounting of substrates in special non-standard packages. Performs thick film screen, dry, and fire operations of various types.

You will be the Microelectronic Bonder for Lockheed Martin Missiles & Fire Control in Chelmsford, MA for our weekend shift. Our team is responsible for fabricating and modifying hybrid microcircuits and sub‑assemblies that support critical defense systems.

What You Will Be Doing

As the Microelectronic Bonder, you will be responsible for executing high‑precision wire‑bonding and hybrid circuit fabrication tasks.

Your Responsibilities Will Include, But Are Not Limited To

• Performs fabrication or modification tasks on hybrid microcircuits and sub-assemblies.
• Performs fabrication of hybrid microcircuits; e.g., aluminum and gold wirebonding under conditions such as small pad sizes down to .001 inch squares, very high semiconductor chip density, unusual substrate configurations which require special setup and bonding techniques.
• Requires the capability to troubleshoot defective hybrids by visual or mechanical screening, wirebonds, or chip placement.

Basic Qualifications

• High school diploma or GED required.
• Ability to obtain and maintain a Secret security clearance, which requires U.S. citizenship

Desired Skills

• Familiarity with bonding microelectronic components and familiarity with manual gold ball and ribbon bonding.
• Familiarity with manual bonding equipment and with automatic bonding equipment.
• Basic computer skills required, including ability to navigate digital systems for timekeeping, work instructions, and task confirmation.
• Strong attention to detail and ability to work in a fast-paced environment.
• Ability to follow written and verbal instructions.
• Ability to learn J-STD-001 and/or IPC-A-610.
• Knowledge of ESD procedures and test equipment.
• Strong work ethic and a reputation for punctuality and reliability, with a desire to grow and learn in their role.

Pay Information

Full-Time Salary Range: $47100.00 - $87500.00

At Lockheed Martin, we know mission success starts with taking care of our people. Our Total Rewards program is designed to attract top talent, support your well-being, and help you grow—both professionally and personally.

The salary range for this position is as listed on the requisition. Please note that the salary information listed is a general guideline only. Lockheed Martin considers factors such as (but not limited to) scope and responsibilities of the position, candidate's work experience, education/ training, key skills as well as market(work location) and business considerations when extending an offer.

Benefits offered: Medical, Dental, Vision, Flexible work arrangements and schedules (e.g., 4x10), 401(k) match, Paid time off, Holidays, Parental Leave, EAP, Flexible Spending Accounts, Education Assistance, Life Insurance, Short-Term Disability, and Long-Term Disability.

• Annual short-term and/or long-term incentive compensation programs may be offered depending on the position. Payments under these annual programs are not guaranteed and can vary from year to year and are tied to a range of performance metrics.
• For (Washington state applicants only) Non-represented full-time employees: accrue at least 10 hours per month of Paid Time Off (PTO) to be used for incidental absences and other reasons; receive at least 90 hours for holidays. Represented full time employees accrue 6.67 hours of Vacation per month; accrue up to 52 hours of sick leave annually; receive at least 96 hours for holidays. PTO, Vacation, sick leave, and holiday hours are prorated based on start date during the calendar year.