Rugged Electronics Packaging Mechanical Engineer II

Marotta Controls; Parsippany-Troy Hills (NJ); On-site; USD 78,000 - 115,000; Full time

Job summary

Marotta Controls in Parsippany, NJ seeks a Mechanical Engineer II (Electronics Packaging) to design rugged electronics enclosures and meet customer requirements through all design stages.

Ideal candidates hold a B.S. in Mechanical Engineering, 2–5 years of packaging experience, strong 3D CAD (Creo), and the ability to solve complex mechanical problems with precision and teamwork. Experience with manufacturability and documentation is a plus.

Qualifications

• B.S. in Mechanical Engineering required.
• 2–5 years design experience, electronics packaging preferred.
• Ability to solve complex mechanical static & dynamic problems.

Responsibilities

• Design ruggedized electronics enclosures to meet customer requirements.
• Interface with electrical engineers to size components and select materials.
• Ensure drawings, BOMs, and design docs are accurate across the project life cycle.
• Coordinate with suppliers, customers, and internal teams.

Skills

Mechanical design

Problem solving

CAD proficiency

Team collaboration

Attention to detail

Education

B.S. in Mechanical Engineering

Advanced technical degree desirable

Tools

PTC Creo

Creo Simulate

ANSYS/ABAQUS

Job description

Marotta Controls in Parsippany, NJ seeks a Mechanical Engineer II (Electronics Packaging) to design rugged electronics enclosures and meet customer requirements through all design stages.

Ideal candidates hold a B.S. in Mechanical Engineering, 2–5 years of packaging experience, strong 3D CAD (Creo), and the ability to solve complex mechanical problems with precision and teamwork. Experience with manufacturability and documentation is a plus.