Electronics Packaging Mechanical Engineer II – Rugged Aerospace

Marotta Controls, Inc.; Parsippany-Troy Hills (NJ); On-site; USD 78,000 - 115,000; Full time

Benefits offered by this job

Medical, dental, vision

Life insurance

401k with company match

Tuition assistance

Paid vacation & holidays

Flexible work hours / compressed work

Job summary

Marotta Controls, Inc. is seeking a Mechanical Engineer II (Electronics Packaging) to design ruggedized electronics and enclosures for aerospace/defense applications.

You will interface with electrical engineers to size circuit card assemblies, specify materials, and ensure accurate drawings and BOMs through all project stages. Responsibilities include conducting preliminary CAD work, reviewing analytical results, and supporting design reviews.

Qualifications

• B.S. in Mechanical Engineering required (advanced degree desirable).
• 2–5 years design experience in electronics packaging preferred.
• Ability to solve complex mechanical static & dynamic problems.
• Attention to detail; high mechanical aptitude.
• Experience with 3D CAD and CREO (CREO/Creo Simulate).
• Excellent verbal/written communication with all stakeholders.
• US Citizenship required.

Responsibilities

• Support the engineering design and development of ruggedized electronics and electronics enclosures to meet customer requirements through all phases of product life cycle.

Education

B.S. in Mechanical Engineering

Advanced technical degree desirable

Tools

3D CAD solid modeling (CreO)

PTC Creo

Creo Simulate

ANSYS

ABAQUS

Job description

Marotta Controls, Inc. is seeking a Mechanical Engineer II (Electronics Packaging) to design ruggedized electronics and enclosures for aerospace/defense applications.

You will interface with electrical engineers to size circuit card assemblies, specify materials, and ensure accurate drawings and BOMs through all project stages. Responsibilities include conducting preliminary CAD work, reviewing analytical results, and supporting design reviews.