Rugged Electronics Packaging Mechanical Engineer

CACI International Inc; City of Rochester (NY); Sur place; USD 75 000 - 158 000; Plein temps

Résumé du poste

CACI International Inc in Rochester, NY is seeking a Mechanical Engineer with 5+ years of experience to design rugged packaging and manage thermal performance for military-grade hardware. The role emphasizes size, weight, power, and packaging considerations in fast-paced projects.

Responsibilities include build-to drawings, supplier collaboration, and coordinating with hardware teams to optimize circuit card layouts for thermal and reliability outcomes. US citizenship is required.

Qualifications

• BS in Mechanical Engineering and 5+ years of experience.
• SolidWorks proficiency is preferred.
• Familiarity with GD&T and DFM principles.

Responsabilités

• Design the packaging for ruggedized equipment with electrical and mechanical elements.
• Perform and interpret thermal simulation analyses aligned with military standard environmental requirements.
• Produce build-to drawings and data packages and collaborate with suppliers to resolve specification, performance, and reliability issues and realize the commercial and custom-machined parts necessary to build the end product.
• Collaborate with hardware designers to jointly optimize circuit card layout with special attention to thermal performance and mitigation.
• Work collaboratively across the engineering organization to understand requirements, provide and incorporate technical feedback, and report status.

Connaissances

Engineering fundamentals

DFM

Formation

BS in Mechanical Engineering

Outils

SolidWorks

SolidWorks Flow Simulation

Description du poste

CACI International Inc in Rochester, NY is seeking a Mechanical Engineer with 5+ years of experience to design rugged packaging and manage thermal performance for military-grade hardware. The role emphasizes size, weight, power, and packaging considerations in fast-paced projects.

Responsibilities include build-to drawings, supplier collaboration, and coordinating with hardware teams to optimize circuit card layouts for thermal and reliability outcomes. US citizenship is required.