RFIC Design Engineer, mm-Wave Transceivers

Amazon Inc.; Omaha (NE); Hybrid; USD 140,000 - 190,000; Full time

Job summary

Amazon Kuiper Manufacturing Enterprises LLC is seeking an RFIC Design Engineer to architect, simulate, and optimize transmit and receive RF front-ends from data converters to LNAs and PAs. You will work with cross-disciplinary teams to drive design decisions and ensure robust, cost-efficient implementations.

The role focuses on power- and area-efficient RFIC chip implementations with multiple transceiver chains, collaborating with packaging, HW, EE, and FW teams to deliver scalable solutions for

Qualifications

• Bachelor's degree in Electrical Engineering or related field.
• 5+ years of mm-Wave/RFIC design experience, preferably on an advanced node.
• Knowledge of RF standards (4G/5G NR, WiMAX, 802.11ad).

Responsibilities

• Collaborate with systems, digital design, and chip implementation teams to specify transceivers and RFIC front-end models.
• Lead implementation of area- and power-efficient RFIC chips with multiple transceiver chains with integrated PLLs.
• Work with packaging/HW/EE/FW teams to ensure seamless system integration for Kuiper customers.
• Define analog/digital boundary requirements for circuit calibration, clock generation, and timing.
• Explore architectures for mm-wave/RF circuits and present power/area/performance trade-offs.
• Design and simulate on-chip inductors, baluns, and power combiners in EMX/HFSS.
• Perform circuit layout, RLC extraction, and run extracted simulations across corners.
• Specify bench and production test plans for designs.

Skills

RFIC design

mm-Wave

Transceiver architecture

Beamforming systems

Circuit layout

Education

Bachelor's degree in Electrical Engineering

Master's degree in Electrical/Communications Engineering

Tools

EMX

HFSS

Job description

Amazon Kuiper Manufacturing Enterprises LLC is seeking an RFIC Design Engineer to architect, simulate, and optimize transmit and receive RF front-ends from data converters to LNAs and PAs. You will work with cross-disciplinary teams to drive design decisions and ensure robust, cost-efficient implementations.

The role focuses on power- and area-efficient RFIC chip implementations with multiple transceiver chains, collaborating with packaging, HW, EE, and FW teams to deliver scalable solutions for