RF Module Design Intern – Summer 2027

Skyworks Solutions, Inc.; New Buffalo (IA); On-site; USD 36,000 - 66,000; Full time

Job summary

Skyworks Solutions, Inc. in Cedar Rapids, IA is seeking a RF Module Design Summer Intern to work with an elite RF team.

You will measure and simulate RF circuits, improve designs, and contribute to Skyworks' high-performance analog semiconductor solutions in a fast-paced environment. The intern will be mentored, gain hands-on experience with RF test equipment, and participate in projects spanning RF connectivity and multi-chip-module evaluations during a Summer 2027 term (May–August).

Qualifications

• Must be enrolled in an Electrical Engineering BS or MS program and returning to school after the internship.
• Internship term: Summer 2027 (May/June - August).
• Strong background in RF and Microwave design.
• Knowledge of RF parameters (insertion loss, return loss, harmonics, IMD, IIP2/3, VSWR, NF, etc.).
• RFIC design and simulation experience is a plus.
• Experience using RF testing equipment (oscilloscope, VNA, spectrum analyzer, RF sources).
• Good communication, data summarization and presentation skills.

Responsibilities

• Support design and test evaluations, and data validation of multi-chip-modules.
• Perform RF tests, evaluate, summarize, and present data to design engineers.
• Assist design using RF modeling tools and production team using test data summary.

Skills

RF design fundamentals

Microwave design

RF testing & debugging

Data summarization & presentation

Strong communication

Education

Electrical Engineering BS or MS (in progress)

Tools

Oscilloscope

VNA

Spectrum analyzer

RF sources

Job description

Skyworks Solutions, Inc. in Cedar Rapids, IA is seeking a RF Module Design Summer Intern to work with an elite RF team.

You will measure and simulate RF circuits, improve designs, and contribute to Skyworks' high-performance analog semiconductor solutions in a fast-paced environment. The intern will be mentored, gain hands-on experience with RF test equipment, and participate in projects spanning RF connectivity and multi-chip-module evaluations during a Summer 2027 term (May–August).