RF Engineer - Sacramento, CA

DAS Technology Group

Sacramento (CA)

On-site

USD 90,000 - 120,000

Full time

14 days+

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Job summary

DAS Technology Group in California is seeking a driven RF engineer to design and validate RF subsystems, including converters, amplifiers, and thin-film circuits. You will implement RF blocks from schematics, run ADS/HFSS/CST simulations, and perform bench measurements with VNAs to verify performance.

The role spans from Engineer I to Senior levels, with increasing responsibility to lead subsystem design, model-to-hardware correlation, and liaison with manufacturing for NPI, BOMs, and EOL

Qualifications

  • Bachelor’s degree in Electrical Engineering or related technical discipline is required.
  • Experience with RF design, testing, and measurement is expected.
  • Ability to interpret RF measurements and correlate with simulations; strong documentation skills.

Responsibilities

  • Implement and test RF building blocks (filters, couplers) from schematics.
  • Run directed simulations (ADS/HFSS/CST) and document results.
  • Execute bench measurements using VNAs and spectrum analyzers; record data.
  • Collaborate with manufacturing on BOMs, DFM/DFT concepts, and EOL considerations.
  • Architect and lead subsystem designs (up/down-converters, mixers, synthesizers).
  • Mentor junior engineers and participate in design reviews.

Skills

RF design
VNA
Spectrum analyzer
EM theory
Impedance matching
Model-to-hardware correlation
RF test equipment

Education

Bachelor’s degree in Electrical Engineering

Tools

ADS
HFSS
CST

Job description

  • Implement and test simple RF building blocks (filters, couplers) from established schematics.
  • Run directed simulations (ADS/HFSS/CST); document results and perform basic parameter sweeps.
  • Execute bench measurements using VNAs and spectrum analyzers; record first-order data.
  • Support BOM creation and EOL data gathering.
  • Collaborate with mechanical/software teams on interface details.
  • Collect and organize test data accurately, perform basic trend analysis, and prepare clear charts and summary reports under guidance.
  • Iterate LNAs/PAs and mixer front ends designs; address biasing, stability, and matching networks.
  • Perform simulations; correlate model-to-measurement; refine designs to meet gain, NF, and linearity.
  • Develop and execute test plans; interpret results to drive corrective actions.
  • Partner with manufacturing on thin-film/PCB/box-build considerations; incorporate DFM/DFT feedback.
  • Create accurate BOMs with alternates; assist with EOL analysis.
  • Proficient in analyzing RF performance data (gain, noise figure, linearity) and correlating results with simulation outputs. Capable of generating structured reports that include observations, root-cause hypotheses, and recommended corrective actions for review by senior engineers.
  • Architect and lead subsystem designs (up/down-converters, mixers, synthesizers); balance gain, NF, linearity, spurious, and thermal stability.
  • Own model-to-hardware correlation; employ EM/circuit co-simulation and statistical analyses.
  • Direct rigorous validation using VNAs, spectrum analyzers, and custom fixtures; interpret complex data.
  • Lead manufacturability integration; manage NPI transitions and reliability/yield tradeoffs.
  • Perform EOL analysis; select replacements and manage compliance impacts.
  • Interpret complex RF test datasets and simulation results to validate subsystem performance. Prepare comprehensive technical reports for internal design reviews, and customer review meetings.
  • Mentor junior engineers and lead design reviews.

Define and oversee RF product architectures and integration into complete systems.

Lead advanced RF design efforts for converters, amplifiers, and complex thin-film circuits; resolve multi-physics/EM interactions.

Establish performance optimization frameworks and acceptance criteria; mentor teams to those standards.

Innovate in simulation/modeling; codify best practices/tool flows.

Direct complex validation campaigns; adjudicate data for architecture-level decisions.

Drive manufacturability/reliability strategies across thin-film, PCB, and box-build; partner with Operations.

Own component lifecycle management and BOM standards; review high-impact bids.

Act as technical liaison across mechanical/software; represent engineering in major customer/executive reviews.

Produces executive-ready/customer-facing technical reports and white papers that articulate design trade-offs, risk assessments, and compliance impacts. Sets standards for data integrity and reporting practices across engineering teams.

Guide adherence to government contract flow-downs and export controls; help scope Technical Assistance Agreements.

Engineer I
  • Implement and test simple RF building blocks (filters, couplers) from established schematics.
  • Run directed simulations (ADS/HFSS/CST); document results and perform basic parameter sweeps.
  • Execute bench measurements using VNAs and spectrum analyzers; record first-order data.
  • Support BOM creation and EOL data gathering.
  • Collaborate with mechanical/software teams on interface details.
  • Collect and organize test data accurately, perform basic trend analysis, and prepare clear charts and summary reports under guidance.
Engineer II
  • Iterate LNAs/PAs and mixer front ends designs; address biasing, stability, and matching networks.
  • Perform simulations; correlate model-to-measurement; refine designs to meet gain, NF, and linearity.
  • Develop and execute test plans; interpret results to drive corrective actions.
  • Partner with manufacturing on thin-film/PCB/box-build considerations; incorporate DFM/DFT feedback.
  • Create accurate BOMs with alternates; assist with EOL analysis.
  • Proficient in analyzing RF performance data (gain, noise figure, linearity) and correlating results with simulation outputs. Capable of generating structured reports that include observations, root-cause hypotheses, and recommended corrective actions for review by senior engineers.
Engineer III (Senior)
  • Architect and lead subsystem designs (up/down-converters, mixers, synthesizers); balance gain, NF, linearity, spurious, and thermal stability.
  • Own model-to-hardware correlation; employ EM/circuit co-simulation and statistical analyses.
  • Direct rigorous validation using VNAs, spectrum analyzers, and custom fixtures; interpret complex data.
  • Lead manufacturability integration; manage NPI transitions and reliability/yield tradeoffs.
  • Perform EOL analysis; select replacements and manage compliance impacts.
  • Interpret complex RF test datasets and simulation results to validate subsystem performance. Prepare comprehensive technical reports for internal design reviews, and customer review meetings.
  • Mentor junior engineers and lead design reviews.
Engineer IV (Staff/Principal)

Define and oversee RF product architectures and integration into complete systems.

Lead advanced RF design efforts for converters, amplifiers, and complex thin-film circuits; resolve multi-physics/EM interactions.

Establish performance optimization frameworks and acceptance criteria; mentor teams to those standards.

Innovate in simulation/modeling; codify best practices/tool flows.

Direct complex validation campaigns; adjudicate data for architecture-level decisions.

Drive manufacturability/reliability strategies across thin-film, PCB, and box-build; partner with Operations.

Own component lifecycle management and BOM standards; review high-impact bids.

Act as technical liaison across mechanical/software; represent engineering in major customer/executive reviews.

Produces executive-ready/customer-facing technical reports and white papers that articulate design trade-offs, risk assessments, and compliance impacts. Sets standards for data integrity and reporting practices across engineering teams.

Guide adherence to government contract flow-downs and export controls; help scope Technical Assistance Agreements.

Requirements
Basic Qualifications:
  • Bachelor’s degree in Electrical Engineering or a related technical discipline
  • US Citizenship required for compliance.
  • Excellent written and oral communication skills.
Technical Qualifications by Level
Engineer I
  • 0-2 years RF design and test experience
  • Familiarity with RF test equipment (VNA, spectrum analyzer) and basic RF theory.
Engineer II
  • MS in RF/Microwave preferred.
  • 2–5 years RF design and test experience; proficiency with ADS/HFSS/CST and RF lab equipment.
  • Strong understanding of EM theory, impedance matching, and signal integrity.
Engineer III (Senior)
  • MS strongly preferred.
  • 5–10 years RF design experience across amplifiers, converters, and thin-film circuits; expertise with ADS/HFSS/CST and RF testing methodologies.
  • Familiarity with RF manufacturing processes; strong compliance knowledge.
Engineer IV (Staff/Principal)
  • MS strongly preferred.
  • 10+ years hands-on RF design with production delivery; expert in simulation tools and advanced RF test methodologies.
  • Deep expertise in EM theory, impedance matching, and signal integrity; fluency in RF manufacturing processes.
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