Remote Principal CPU Physical Design & Methodology Engineer

Tenstorrent

Santa Clara (CA)

Remote

USD 100,000 - 500,000

Full time

7 days ago
Be an early applicant

Get a reply from this employer

Your resume and cover letter, tailored to exactly what they’re hiring for.

Get past ATS filters

Job summary

Tenstorrent is seeking a Physical Design CPU Methodology Engineer to define and drive the implementation methodology, automation strategy, and signoff infrastructure for high‑performance CPU cores across advanced process nodes.

This role is remote based out of the United States and welcomes candidates at various experience levels; offers will align with the level determined during interviews. You will collaborate across teams to enable AI/ML driven PD workflows.

Qualifications

  • 10+ years ASIC/SoC/CPU experience required.
  • Expertise in RTL-to-GDS implementation and signoff.
  • Proficient in Tcl, Python and Perl scripting.
  • Demonstrated leadership and cross-team collaboration.

Responsibilities

  • Define scalable CPU physical design methodology across synthesis, floorplanning, place & route, CTS, extraction, STA and signoff.
  • Explore AI/ML‑enabled PD tooling and begin PD for CPU partitions with new RM flow.
  • Drive automation, constraints, quality metrics, dashboards and debug workflows.
  • Partner with architecture, RTL, circuit, DFT, CAD, data and EDA vendor teams.

Skills

ASIC/SoC CPU experience
Tcl scripting
Python scripting
Perl scripting
CAD/EDA tools

Tools

EDA tools
P&R flows

Job description

Tenstorrent is seeking a Physical Design CPU Methodology Engineer to define and drive the implementation methodology, automation strategy, and signoff infrastructure for high‑performance CPU cores across advanced process nodes.

This role is remote based out of the United States and welcomes candidates at various experience levels; offers will align with the level determined during interviews. You will collaborate across teams to enable AI/ML driven PD workflows.

Get your free, confidential resume review.

or drag and drop your file here.

Similar jobs

Similar jobs worth comparing

Physical Design CPU Methodology Engineer
Physical Design CPU Methodology Engineer

Tenstorrent • Santa Clara (CA)

Remote
USD 100,000 - 500,000
Physical Design Engineer
Physical Design Engineer

Tenstorrent • United States

On-site
USD 100,000 - 500,000
Highly competitive compensation package
Benefits
Chiplet Physical Design Engineer
Chiplet Physical Design Engineer

Tenstorrent • United States

Remote
USD 100,000 - 500,000
Equal opportunity employer
Remote work option
Top Level Physical Design Engineer
Top Level Physical Design Engineer

Tenstorrent • Santa Clara (CA)

On-site
USD 100,000 - 500,000
Highly competitive compensation package
Benefits offered
Hardware - Architecture - Architecture Chiplet Physical Design Engineer
Hardware - Architecture - Architecture Chiplet Physical Design Engineer

Tenstorrent Inc. • United States

On-site
USD 100,000 - 500,000
Highly competitive compensation package
Equal opportunity employer
Comprehensive benefits
Physical Design Intern – CPU/AI Hardware
Physical Design Intern – CPU/AI Hardware

Austin Community College • Santa Clara (CA)

On-site
USD 68,880 - 96,432
Highly competitive compensation package
Benefits
Equal opportunity employer
Datacenter AI Workload Performance Engineer
Datacenter AI Workload Performance Engineer

Tenstorrent • Santa Clara (CA)

Remote
USD 100,000 - 500,000
Physical Design Engineer, PnR
Physical Design Engineer, PnR

Tenstorrent • United States

On-site
USD 100,000 - 500,000
Physical Design Intern - CPU/AI Hardware
Physical Design Intern - CPU/AI Hardware

Southern Arkansas University • Texas

On-site
USD 68,880 - 96,432
Highly competitive compensation package
Benefits
Equal opportunity employer
Physical Design Intern - CPU/AI Hardware at Tenstorrent
Physical Design Intern - CPU/AI Hardware at Tenstorrent

Wayne State University • Texas

Hybrid
USD 68,880 - 96,432
Highly competitive compensation package
Benefits
Equal opportunity employer