Recent Graduate-Process Engineer – Advanced Semiconductor Packaging

Keysight Technologies, Inc.

Santa Rosa (CA)

Presencial

USD 77.000 - 191.000

Jornada completa

Hace 9 días

Una candidatura completa en un minuto

Currículum y carta de presentación personalizados, listos para enviar.

Supera los filtros ATS

Ventajas ofrecidas por este puesto de trabajo

Medical, dental and vision

401(k) Plan

Flexible Time Off

Tuition Reimbursement

Descripción de la vacante

Keysight Technologies in Santa Rosa, CA is seeking a Process Engineer in Advanced Packaging to develop next-generation SiP modules. You will lead process research, drive CPI improvements, and work with cross-functional teams to meet aggressive schedules.

The role requires MS/PhD or BS with strong semiconductor fabrication experience, and a willingness to work onsite in Santa Rosa. Candidates must be local or relocate. Expect collaboration across design, process, and manufacturing teams.

Formación

MS/PhD in Materials Science, Physics, Chemistry, Mechanical Engineering, Manufacturing Engineering, Mechatronics, or relevant fields coupled with applicable experience in semiconductor fabrication processes.
BS graduates with relevant experimental research experience will also be considered.

Responsabilidades

Lead development of next-generation System in Package (SiP) modules integrated with microwave and mmWave subsystems across Keysight.
Drive process control and stability through SPC, root-cause analysis, and corrective actions.
Work with process/integration/product/SiP design engineers to define targets.
Define process flows, develop new processes and CPI-driven improvements to maximize yield.
Develop and maintain high yields; report metrics and investigate root causes.
Ensure successful hand-off to manufacturing partners.
Collaborate with upstream design and manufacturing teams; manage risks and schedules.

Conocimientos

Process development

Data-driven optimization

Statistical analysis

SPC (statistical process control)

Communication skills

JMP

Educación

MS/PhD in Materials Science, Physics, Chemistry, Mechanical Engineering, Manufacturing Engineering, Mechatronics (or related)

BS with relevant experimental research experience

Herramientas

JMP

Descripción del empleo

Overview

Keysight is at the forefront of technology innovation, delivering breakthroughs and trusted insights in electronic design, simulation, prototyping, test, manufacturing, and optimization. Our ~15,000 employees create world-class solutions in communications, 5G, automotive, energy, quantum, aerospace, defense, and semiconductor markets for customers in over 100 countries. Learn more about what we do.

Our award-winning culture embraces a bold vision of where technology can take us and a passion for tackling challenging problems with industry-first solutions.We believe that when people feel a sense of belonging, they can be more creative, innovative, and thrive at all points in their careers.

We provide semiconductor technologies that drive Keysight’s market leadership and revenue. The High Frequency Technology Center (HFTC) is seeking a Process Engineer in Advanced Packaging to develop next generation technologies and new products. Experience in microelectronics assembly, die attach, surface mount technology (SMT) or other relevant hands‑on experience is required for success. This position is onsite at Keysight Headquarters in Santa Rosa, CA. Live in beautiful Sonoma County amongst vineyards, redwood forests, rivers, lakes and coastline while working on state‑of‑the‑art advanced packaging technologies.

HFTC is a world-class semiconductor organization that invents, designs, and manufactures state‑of‑the‑art custom integrated circuits (ICs) to enable the industry’s highest-performance test and measurement solutions. HFTC’s proprietary indium phosphide (InP) and gallium arsenide (GaAs) semiconductor, silicon and heterogeneous integration technologies make possible some of the world’s highest-speed and highest-frequency Monolithic Microwave Integrated Circuits (MMICs) and System in Package (SiP) products. Our chips and systems are custom designed to enable instrumentation with unmatched signal fidelity, bandwidth, and dynamic range. Keysight’s 50,000 sq. ft. microfabrication facility—paired with deep expertise in design, modeling, and advanced compound semiconductor and silicon manufacturing—provides a distinct competitive advantage in delivering industry-leading performance.

Responsibilities

We focus on process research and development, process integration, and New Product Introduction. You will lead the development of next‑generation System in Package (SiP) modules that will be integrated with microwave and mmWave subsystems across Keysight, serving multiple industries.

Drive process control and stability through statistical process control (SPC), root cause analysis, and corrective actions using statistical tools (e.g., JMP)
Work closely with other process, integration, product, and SiP design engineers to define process and performance targets
Defining process flows, develop new processes and drive continuous process improvement (CPI) efforts to maximize product yield
Develop and maintain high yields; report process metrics, root cause investigations, and process change implementations at the department level
Ensure successful process hand off to manufacturing partners
Work with Operations to implement robust process control and support production processes; diagnose and resolve process problems with urgency
Champion and lead capital equipment acquisition projects that include tool evaluation, characterization, process development, and qualification
Propose Design of Experiment (DOE) plans, conducting experiments, and implementing process changes in a controlled fashion.
Collaborate with equipment engineering on tool performance optimization, preventive maintenance strategies, throughput enhancements
Lead technical development of new SiP introductions in collaboration with upstream design teams, process and manufacturing teams, and downstream customer teams
Meet accelerated project schedules; communicate and manage risks
Develop and maintain high yields while adhering to project schedules

Depending on the candidate’s expertise, responsibilities may include one or more of the following domains:

Die attach: flip chip and thermocompression bonding (TCB)
Surface cleaning and preparation
Automatic adhesive dispense and pick and place, SMT
Automatic die singulation and sort
Metrology: profilometry, SEM, XRF, optical microscopy, automatic inspection
Broader experience in upstream and downstream processes and the ability to understand process interactions is valued.
Review new designs for manufacturability and provide feedback to module designers

Qualifications

Required Qualifications

M.S. or Ph.D. in Materials Science, Physics, Chemistry, Mechanical Engineering, Manufacturing Engineering, Mechatronics, or relevant fields coupled with applicable experience training and interest in semiconductor fabrication processes.

B.S. graduates with relevant experimental research experience will also be considered.

Qualified candidates must be a recent graduate in 2026 or degree completed by June 2027.Candidates must be local or willing to relocate to Santa Rosa, CA

We are seeking a recent graduate with expertise/academic training or internship experience in one or more of the following areas:

Cleanroom, microelectronics, or related experimental research
Proven experience in process development and data‑driven process optimization
Strong problem‑solving and analytical skills for controlling process variation
Excellent interpersonal, verbal, written and presentation communication skills. The successful candidate must be able to communicate complex technical information in a clear, concise, and direct manner, present data effectively to both small and large audiences, and collaborate productively across cross‑functional teams.
Strong accountability, self‑initiative and proactive attitude are required for success.

The following qualifications are desired but not required:

Industrial semiconductor, advanced packaging, or Heterogeneous integration experience
Familiarity with programming and operating automatic assembly equipment
Knowledge of and experience with forming metallurgical bonds between similar metals
Experience with adhesives, underfill materials, and dispense processes
Experience with wafer singulation processes
Thermal, mechanical and electrical reliability
Project lifecycle
III‑V compound semiconductors and/or silicon technologies

This role requires working inside a cleanroom for several hours each day. Candidates should be comfortable handling real products and flexing their time between the cleanroom and the office space.

Candidates must be local or willing to relocate to Santa Rosa, CA

This position requires access to certain goods, software, technology, or technical data subject to U.S. export control laws and regulations. Under these laws and regulations, U.S. persons (which includes U.S. citizens, U.S. nationals, lawful permanent residents, refugees, and asylees) working for Keysight can access export‑controlled items without authorization from the U.S. government. For any individual who is not a U.S. person, Keysight may need authorization from the U.S. Department of State, U.S. Department of Commerce, or other appropriate federal agency before the individual can access export‑controlled items. Candidates must be a U.S. citizen or lawful permanent resident of the U.S., or protected individual, having authorization from the U.S. government for export‑controlled items under 8 U.S.C. 1324b(a)(3).

Keysight is an Equal Opportunity Employer.

Careers Privacy Statement

The level of role will be based on applicable experience, education and skills; Most offers will be between the minimum and the midpoint of the Salary Range listed below.

Santa Rosa, CA Pay Range: MIN $76,870.00 - MAX $191,030

Note: For other locations, pay ranges will vary by region.

This role is eligible for Keysight Results Bonus Program and US Employees may be eligible for the following benefits: