R&D/PRODUCT DVL ENGINEER II

TE Connectivity Corporation; Pennsylvania (AL); Remote; USD 88,000 - 133,000; Full time

Job summary

TE Connectivity Corporation is seeking a skilled R&D/Product Development Engineer to lead technical initiatives and drive product development in high-speed interconnect technologies. This role involves collaborating with customers and internal teams to align product strategies with industry standards and emerging trends. Ideal candidates will have a Bachelor's degree in Mechanical Engineering and extensive experience in relevant fields, alongside strong analytical skills and effective communication abilities.

Qualifications

• 3+ years of experience in compute, networking, AI, or storage system design.
• Knowledge of hardware and associated signaling environments.
• Familiarity with industry standards like PCIe, CXL, Ethernet, and InfiniBand.

Responsibilities

• Act as a key technical interface for hyperscalers and OEMs.
• Define high-level system architecture requirements.
• Drive execution of innovative technical projects.

Skills

Technical expertise in high-speed engineering and design

Strong analytical and problem-solving skills

Effective communication

Relationship building

Education

Bachelor’s degree in Mechanical Engineering

Tools

Simulation tools

Modeling tools

CAD

Signal integrity analysis

Job description

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At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world.

Job Overview

TE Connectivity’s R&D/Product Development Engineering Teams conceive original ideas for new products, introduce them into practice. They are responsible for product development, and qualification from market definition through production and release; assist in the qualification of suppliers for new products to ensure suppliers deliver quality parts, materials, and services for new or improved manufacturing processes; conduct feasibility studies, testing on new and modified designs; direct and support detailed design, testing, prototype fabrication and manufacturing ramp. The R&D/Product Development Engineering Teams provide all required product documentation including, but not limited to, Solid Model, 2D/3D production drawings, product specifications, and testing requirements. They create and modify detailed drawings and drafting or conceptual models from layouts, rough sketches or notes and contribute to design modifications to facilitate manufacturing operation or quality of product. Typical fields of expertise include: materials, mechanics and systems, electrical, optics, chemistry, software, automation systems, packaging, testing and measurement, and manufacturing of electrical, mechanical and electronic components, products, and their integration into systems.

Key Responsibilities

Technical Leadership & Customer Engagement

• Act as one of the key technical interfaces for hyperscalers, OEMs, and system architects, to gain insights into next-generation compute, AI, storage, and networking challenges.
• Identify and assess technology disruptors, translating emerging trends into strategic R&D initiatives and product development roadmaps to maintain TE’s industry leadership.
• Cultivate and strengthen customer partnerships, fostering co-development opportunities and collaborative innovation to accelerate next-gen infrastructure advancements.
• Support internal stakeholders, including product development, R&D, and sales teams, by providing technical guidance on next-gen interconnect technologies.

System-Level Architecture & Product Strategy

• Define high-level system architecture requirements, ensuring TE’s product roadmap is aligned with next-generation compute, AI, and networking ecosystems.
• Bridge the gap between customer needs and TE’s technology roadmap, ensuring TE delivers future-proof, scalable, and high-performance interconnect solutions tailored to the evolving data infrastructure landscape.
• Drive TE’s technology vision and strategy, ensuring our interconnect solutions support the evolving needs of standards like PCIe, CXL, Ethernet, InfiniBand, and the next-gen AI workloads.
• Lead the evaluation of high-speed electrical, optical, and hybrid interconnect solutions, balancing performance, power, latency, cost, and manufacturability.
• Collaborate with senior architects and internal R&D, product development, and business units to shape product development roadmaps based on real-world customer challenges and market trends.

Standards Development & Industry Influence

• Actively participate in and influence key industry standards groups (e.g., OCP, PCI-SIG, IEEE, Ethernet Alliance, CXL Consortium), ensuring TE’s strategic alignment with the future of data communication.
• Support senior architects in leading and influencing discussions on emerging protocols and interface standards, ensuring TE is at the forefront of next-generation high-speed, low-latency interconnect technologies.
• Actively contributing to the development of next-gen copper and optical interconnect standards, positioning TE as an industry innovator, ensuring our solutions stay ahead of the competition
• Represent TE at industry forums, conferences, and standards organizations, reinforcing our role as a leader in high-speed interconnect technology and ensuring our strategic perspectives drive industry advancements.
• Develop and present thought leadership content, including technical whitepapers, reference designs, and industry presentations, to amplify TE’s influence within the standards community and the broader industry ecosystem.

Cross-Functional Leadership & Execution

• Work cross-functionally with engineering, product management, sales, and marketing teams to translate technical insights into compelling product offerings.
• Drive the execution of high-impact, innovative technical projects, ensuring seamless alignment between customer needs, business goals, and engineering capabilities.
• Guide TE’s go-to-market strategy for new interconnect solutions, ensuring that our technical differentiation is clearly communicated and leveraged in competitive landscapes.

What your background should look like:

• Bachelor’s degree in MechanicalEngineering.
• 3+ years of experience in compute, networking, AI, or storage system design and high-speed interconnect technologies.
• Knowledge of compute, AI/ML, networking, and storage architectures.
• Knowledge of hardware and associated signaling environments.
• Technical expertise in high-speed engineering and design
• Familiarity with industry standards like PCIe, CXL, Ethernet, and InfiniBand.
• Experience with industry-standard design tools (e.g., simulation, modeling, CAD, or signal integrity analysis).
• Strong analytical and problem-solving skills, with experience in design trade-offs for power, latency, and scalability.
• Effective communicator, able to present technical concepts to internal teams, customers, and industry partners.
• Effectively able to build relationships with external customers and industry leaders as well as internally across all levels, disciplines, and geographies
• Self-motivated with the ability to take the initiative to accomplish tasks with limited directions.
• Ability to spend 10%-25% of your time traveling to customers, conferences, and TE development sites.

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Competencies

Values: Integrity, Accountability, Inclusion, Innovation, Teamwork

COMPENSATION

• Competitive base salary commensurate with experience: $88,400– $132,500(subject to change dependent on physical location)
• Posted salary ranges are made in good faith. TE Connectivity reserves the right to adjust ranges depending on the experience/qualification of the selected candidate as well as internal and external equity.
• Total Compensation = Base Salary + Incentive(s) + Benefits

Location:

#, PA, US, _

City: #

State: PA

Country/Region: US

Travel: 25% to 50%

Requisition ID: 131771

Alternative Locations: