R&D Process Development Engineer

TTM Technologies; Eau Claire (WI); On-site; USD 90,000 - 130,000; Full time

Benefits offered by this job

Medical

Dental

Vision

401K

Flexible Spending Account

Health Savings Account

Life insurance

Disability benefits

Paid vacation & holidays

Job summary

TTM Technologies, Inc. is seeking a highly technical R&D Process Development Engineer to develop, characterize, optimize, and scale SAP build-up processes for advanced PCB fabrication.

The role sits at the intersection of materials science, chemistry, precision engineering, and manufacturing, demanding deep scientific rigor and practical manufacturing instincts. The candidate should be comfortable running controlled experiments in a lab and developing processes on small-scale production

Qualifications

• 3–8 years of hands-on process engineering experience in PCB manufacturing or related wet chemistry/precision manufacturing.
• Direct, hands-on experience with at least two of: Mechanical, Lithography, Electroplating, or Etching.
• Preferred: experience in semiconductor fab or FOWLP processes.

Responsibilities

• Develop SAP build-up processes and equipment that can be scaled for production across markets.
• Evaluate and set up new equipment and derive processes to achieve intended results.
• Bridge science and production with clear communication and technical credibility.

Skills

SAP Build-up

SPC

DoE

FOWLP knowledge

Education

Bachelor of Science in Chemical Engineering

Master/PhD in Chemical/ Electrical Engineering

Tools

Genesis CAM350

IPC standards

SEM/EDS

Job description

TTM Technologies, Inc. - Publicly Traded US Company, NASDAQ (TTMI) - Top-5 Global Printed Circuit Board Manufacturer

TTM Technologies, Inc. is a leading global manufacturer of technology products, including mission systems, radio frequency ("RF") components, RF microwave/microelectronic assemblies, and technologically advanced printed circuit boards ("PCB"s). TTM stands for time-to-market, representing how TTM's time-critical, one-stop design, engineering and manufacturing services enable customers to reduce the time required to develop new products and bring them to market

Additional information can be found at www.ttm.com

TTM Technologies is a leading manufacturer of high-reliability printed circuit boards serving the aerospace, defense, medical device, telecommunications, automotive, and industrial electronics markets. Our manufacturing capabilities span rigid, flex, rigid-flex, HDI, RF/microwave, and advanced multilayer constructions. We are committed to pushing the boundaries of PCB technology through disciplined process development, continuous improvement, and an unwavering dedication to quality and customer satisfaction.

POSITION SUMMARY

The R&D Process Development Engineer is a highly technical individual contributor responsible for developing, characterizing, optimizing, and scaling advanced manufacturing processes associated with Semi-Additive Plating (SAP) build up technology. Familiarity with Semi-Conductor or Fan-Out Wafer Level Packaging FOWLP process techniques is a plus as line and space characteristics are approaching historic Integrated Circuit sizes. Need for R&D engineering across four critical PCB fabrication disciplines: Mechanical Processing, Lithography, Electroplating, and Etching. This role sits at the intersection of materials science, chemistry, precision engineering, and manufacturing - requiring both deep scientific rigor and practical manufacturing instincts.

This individual is expected to be the recognized technical authority within their focus areas - able to think outside of the standard and come up with solutions to complex problems, evaluate and set up new equipment and derive processes around those tools to achieve intended results.

This role requires someone equally comfortable running-controlled experiments in a laboratory and developing processes on small scale production manufacturing equipment- someone who bridges the gap between science and production with clarity, confidence, and technical credibility.

KEY RESPONSIBILITIES

Semi-Additive (SAP) Build-up Process Development Equipment definition, purchase, setup and qualification for R&D. Develop technology that can be scaled to provide solutions to customers across TTM's markets.

REQUIRED QUALIFICATIONS

Education

• Required: Bachelor of Science in Chemical Engineering, Materials Science, Chemistry, Mechanical Engineering, or closely related discipline.
• Preferred: Master or PhD of Science in Chemical Engineering, Materials Science, or Electrical Engineering with a focus on electronic materials or manufacturing.

Experience

• Required: 3-8 years of hands-on process engineering experience in PCB manufacturing, or a closely related wet chemistry/precision manufacturing environment.
• Required: Direct, hands-on experience with at least two of the four focus areas: Mechanical, Lithography, Electroplating, or Etching.
• Preferred: Experience in semiconductor fab or FOWLP,

Technical Knowledge

• SAP: Fundamentals of SAP Build up or FOWLP technology including hands on experience.
• General: SPC, Design of Experiments (DoE), Cpk/Ppk analysis, failure analysis methodologies (SEM/EDS, optical microscopy, ICP-MS, XRF, FTIR), IPC standards (IPC-A-600, IPC-6012, IPC-TM-650, IPC-4552), ERP/MES systems, CAM software (Genesis, CAM350), SEMI Standards.

WORK ENVIRONMENT

• Primary Setting: PCB manufacturing facility - process engineering laboratory and production floor.
• Chemical Exposure: Regular work with hazardous chemicals including strong acids (HSO, HCl, HNO, HF), alkalis, copper sulfate, formaldehyde, photoresist chemicals, etchants, and plating bath additives.
• PPE Required: Chemical-resistant gloves, safety glasses/face shield, lab coat, acid-resistant apron, and additional PPE as required by SDS and EHS protocols.
• Physical Requirements: Ability to stand for extended periods; lift and carry up to 35 lbs; visual acuity for microscopic examination and precision measurement.
• Travel: Occasional travel to customer sites, equipment vendors, chemical suppliers, and industry conferences (10-20%).

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Compensation and Benefits

TTM offers a variety of health and well-being benefit programs.

• medical
• dental
• vision
• 401K
• Flexible Spending Account
• Health Savings Account
• accident benefits
• life insurance
• disability benefits
• paid vacation & holidays

Benefits are available 1st of the month following date of hire.

Compensation for roles at TTM Technologies varies depending on a wide array of factors including but not limited to the specific office location, role, skill set and level of experience. As required by local law, TTM provides a reasonable range of compensation for roles that may be hired in New York, California and Colorado. For California-based roles, compensation ranges are based upon specific physical locations.

Export Statement

Must comply with TTM Export Control Policies and Procedures and all applicable laws including ITAR, EAR and OFAC including but not limited to: a) being able to identify ITAR product on the manufacturing floor and understand that access to these products and related technical data is restricted to only US Citizens and US Permanent Residents; b) recognitionofForeign Person visitors by badge differentiation; c) understand and follow authorization procedures for bringing foreign visitors into facilities (VAL); d) understand the Export and ITAR requirements for shipments leaving the US; e) manage vendor approvals for ITAR manufacturing and services.

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, citizenship, disability or protected veteran status.