R&D Process Development Engineer

El Camino Health; Eau Claire (WI); On-site; USD 90,000 - 130,000; Full time

Benefits offered by this job

Medical, Dental, Vision

401K

HSA/FP

Job summary

TTM Technologies, Inc. is seeking an experienced R&D Process Development Engineer to advance SAP build-up technology across mechanical, lithography, electroplating, and etching disciplines.

You will design, run controlled experiments, and scale processes from lab to production, collaborating with materials science and manufacturing teams. Ideal candidates bring 3–8 years in PCB manufacturing or wet chemistry, a BS in Chemical Engineering or related field, and hands-on experience in at least two

Qualifications

• Bachelor of Science in Chemical Engineering, Materials Science, Chemistry, Mechanical Engineering, or closely related discipline.
• Master or PhD in Chemical Engineering, Materials Science, or Electrical Engineering with a focus on electronic materials or manufacturing is preferred.
• 3–8 years of hands‑on process engineering experience in PCB manufacturing or related wet chemistry/precision manufacturing.

Responsibilities

• Semi-Additive (SAP) Build-up Process Development Equipment definition, purchase, setup and qualification for R&D.
• Develop technology scalable to customer needs across TTM’s markets.

Skills

Process engineering

Chemical engineering knowledge

DoE

Statistical analysis

Education

Bachelor of Science in Chemical Engineering / Materials Science / related

Master or PhD in Chemical Engineering / Materials Science / Electrical Engineering

Tools

CAM software Genesis

CAM350

SEM/EDS / ICP-MS / FTIR

IPC standards (A-600, 6012, TM-650, 4552)

ERP/MES systems

Job description

TTM Technologies, Inc. – Publicly Traded US Company, NASDAQ (TTMI) – Top-5 Global Printed Circuit Board Manufacturer About TTM TTM Technologies, Inc. is a leading global manufacturer of technology products, including mission systems, radio frequency (“RF”) components, RF microwave/microelectronic assemblies, and technologically advanced printed circuit boards (“PCB”s). TTM stands for time-to-market, representing how TTM's time-critical, one-stop design, engineering and manufacturing services enable customers to reduce the time required to develop new products and bring them to market. Additional information can be found at www.ttm.com TTM Technologies is a leading manufacturer of high-reliability printed circuit boards serving the aerospace, defense, medical device, telecommunications, automotive, and industrial electronics markets.

Our manufacturing capabilities span rigid, flex, rigid-flex, HDI, RF/microwave, and advanced multilayer constructions. We are committed to pushing the boundaries of PCB technology through disciplined process development, continuous improvement, and an unwavering dedication to quality and customer satisfaction.

POSITION SUMMARY

The R&D Process Development Engineer is a highly technical individual contributor responsible for developing, characterizing, optimizing, and scaling advanced manufacturing processes associated with Semi-Additive Plating (SAP) build up technology. Familiarity with Semi-Conductor or Fan-Out Wafer Level Packaging (FOWLP) process techniques is a plus as line and space characteristics are approaching historic Integrated Circuit sizes. Need for R&D engineering across four critical PCB fabrication disciplines: Mechanical Processing, Lithography, Electroplating, and Etching. This role sits at the intersection of materials science, chemistry, precision engineering, and manufacturing — requiring both deep scientific rigor and practical manufacturing instincts. This individual is expected to be the recognized technical authority within their focus areas — able to think outside of the standard and come up with solutions to complex problems, evaluate and set up new equipment and derive processes around those tools to achieve intended results. This role requires someone equally comfortable running-controlled experiments in a laboratory and developing processes on small scale production manufacturing equipment— someone who bridges the gap between science and production with clarity, confidence, and technical credibility.

KEY RESPONSIBILITIES

• Semi-Additive (SAP) Build-up Process Development Equipment definition, purchase, setup and qualification for R&D.
• Develop technology that can be scaled to provide solutions to customers across TTM’s markets.

REQUIRED QUALIFICATIONS

• Education Required: Bachelor of Science in Chemical Engineering, Materials Science, Chemistry, Mechanical Engineering, or closely related discipline.
• Preferred: Master or PhD of Science in Chemical Engineering, Materials Science, or Electrical Engineering with a focus on electronic materials or manufacturing.
• Experience Required: 3–8 years of hands‑on process engineering experience in PCB manufacturing, or a closely related wet chemistry/precision manufacturing environment.
• Required: Direct, hands‑on experience with at least two of the four focus areas: Mechanical, Lithography, Electroplating, or Etching.
• Preferred: Experience in semiconductor fab or FOWLP.
• Preferred: Experience in semiconductor fab or FOWLP, Technical Knowledge SAP: Fundamentals of SAP Build up or FOWLP technology including hands on experience. General: SPC, Design of Experiments (DoE), Cpk/Ppk analysis, failure analysis methodologies (SEM/EDS, optical microscopy, ICP-MS, XRF, FTIR), IPC standards (IPC-A-600, IPC-6012, IPC-TM-650, IPC-4552), ERP/MES systems, CAM software (Genesis, CAM350), SEMI Standards.

WORK ENVIRONMENT

• Chemical Exposure: Regular work with hazardous chemicals including strong acids (H₂SO₄, HCl, HNO₃, HF), alkalis, copper sulfate, formaldehyde, photoresist chemicals, etchants, and plating bath additives.
• PPE Required: Chemical-resistant gloves, safety glasses/face shield, lab coat, acid-resistant apron, and additional PPE as required by SDS and EHS protocols.
• Physical Requirements: Ability to stand for extended periods; lift and carry up to 35 lbs; visual acuity for microscopic examination and precision measurement.
• Travel: Occasional travel to customer sites, equipment vendors, chemical suppliers, and industry conferences (10–20%).

Compensation and Benefits

TTM offers a variety of health and well-being benefit programs.

• Benefit options include medical, dental, vision, 401K, Flexible Spending Account, Health Savings Account, accident benefits, life insurance, disability benefits, paid vacation & holidays.
• Benefits are available 1st of the month following date of hire.
• Compensation for roles at TTM Technologies varies depending on a wide array of factors including but not limited to the specific office location, role, skill set and level of experience.
• As required by local law, TTM provides a reasonable range of compensation for roles that may be hired in New York, California and Colorado.
• For California-based roles, compensation ranges are based upon specific physical locations.

TTM is always looking for top talent.

Export Statement

Must comply with TTM Export Control Policies and Procedures and all applicable laws including ITAR, EAR and OFAC including but not limited to: a) being able to identify ITAR product on the manufacturing floor and understand that access to these products and related technical data is restricted to only US Citizens and US Permanent Residents; b) recognition of Foreign Person visitors by badge differentiation; c) understand and follow authorization procedures for bringing foreign visitors into facilities (VAL); d) understand and follow the Export and ITAR requirements for shipments leaving the US; e) manage vendor approvals for ITAR manufacturing and services.

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, citizenship, disability or protected veteran status.

TTM Technologies, Inc. is a leading global manufacturer of technology solutions including engineered systems, radio frequency (“RF”) components and RF microwave/microelectronic assemblies, and quick-turn and technologically advanced printed circuit boards (“PCBs”). TTM stands for time-to-market, representing how TTM's time-critical, one‑stop manufacturing services enable customers to shorten the time required to develop new products and bring them to market.