Quantum Packaging Signal/Power Integrity (SI/PI) Engineer

Intel Corporation; Hillsboro (OR); On-site; USD 142,000 - 200,000; Full time

Benefits offered by this job

Stock bonuses

Health benefits

Retirement plan

Paid vacation

Job summary

Intel Corporation in Oregon is seeking a Quantum Packaging SI/PI Engineer to model and simulate packaging hardware from redistribution layers to IC substrates for silicon quantum dot technology. You will collaborate across theory, hardware, and packaging teams to advance scalable quantum systems and meet design requirements.

The role emphasizes strong communication, system-level thinking, and adaptability in a fast-paced research environment, with on-site work in Hillsboro, OR.

Qualifications

• MS/PhD with 3+ years of SI/PI experience in packaging or related hardware
• Experience with SI/PI modeling, simulation, and optimization
• Experience with IC substrates design choices and large form factor substrates
• Preferred: testchip SI software experience (RaptorH/X)

Responsibilities

• Modeling and simulation of packaging hardware including redistribution layers, IC substrates, and silicon testchip routing
• Collaborate with stakeholders to meet design requirements across theory and hardware teams
• System-level modelling and end-to-end simulations to meet system-level requirements
• Deliver and disseminate design milestones to stakeholders
• Communicate designs in presentations and documentation
• Stay current with packaging technology through conferences and papers

Skills

SI/PI modeling

System-level simulation

Cross-functional collaboration

Strong communication

Problem solving

Education

MS in Electrical Engineering or Physics

PhD in Electrical Engineering or Physics

Tools

SIwave

HFSS

ADS

RaptorH/X

Job description

Job Details:

Job Description:

Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide.

We are seeking an exceptional Quantum Packaging Signal/Power Integrity (SI/PI) Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for modeling and simulation of various packaging solutions from silicon redistribution layers to IC substrates within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing.

Key Responsibilities

• Modeling and simulation of packaging hardware including redistribution layers (e.g., interposers, RDLs), IC substrates, and silicon testchip routing
• Work closely with stakeholders to meet design requirements - requirements come from both theory and hardware teams. In some pathfinding projects, you will be asked to participate in creating requirements and novel packaging hardware.
• System-level modelling and simulation; end-to-end simulations to ensure designs meet system-level requirements
• Deliver and disseminate design milestones to stakeholders
• Communicate designs in presentations and relevant documentation
• Stay current with the latest developments in packaging technology and design techniques by attending conferences and reading papers

As a successful candidate, you must possess

• Excellent communication and presentation skills for technical and non-technical audiences
• Strong analytical thinking and problem-solving capabilities
• Collaborative mindset with ability to work effectively across diverse teams
• Adaptability to work in a fast-paced, innovative research environment
• Passion for pushing the boundaries of quantum technology development

Join Intel's Quantum Computing Group where we are building the future of quantum computing. If you're passionate about working at the forefront of quantum computing packaging and want to work with the resources and expertise of the world's leading semiconductor company, we want to hear from you.

Qualifications

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of relevant industry job experience, internship experience and/or schoolwork/classes/research.

Minimum Qualifications:
M.S. degree in Electrical Engineering, Physics or related field AND 3+ years of experience in SI/PI for packaging, silicon testchip, or other related hardware. OR
Ph.D. degree in Electrical Engineering, Physics or related field with academic or work experience in the related areas.

The experience must include:

• SI/PI modeling, simulation, and optimization with simulation software such as SIwave, HFSS, ADS, and related.
• SI/PI/thermal impact on IC substrate design choices.
• Design experience with large form factor IC substrates.

Preferred Qualifications:

• 1+ years of experience with testchip SI software for large-scale automation (e.g., RaptorH/X).

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location:

US, Oregon, Hillsboro

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $141,910.00-200,340.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

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ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.