Quantum Hardware Engineer — Cryogenic Packaging & Design

Amazon; Pasadena (CA); On-site; USD 142,800 - 193,200; Full time

Benefits offered by this job

RSUs

Health insurance

Job summary

Amazon’s Quantum Center is seeking a Research Engineer specializing in hardware design for cryogenic environments to drive end-to-end development of quantum processor packaging and signal delivery systems. You will apply 3D CAD, FEA, and manufacturing know-how in a cross-functional team to deliver robust, scalable hardware solutions for quantum computing applications.

The role demands hands-on experience with cryogenic mechanical engineering, design for manufacturing, and a proven track record

Qualifications

• Bachelor's degree or higher in mechanical engineering, electrical engineering, material science, physics or equivalent.
• 6+ years of relevant experience with a Bachelor's, 5+ with a Master’s, or 2+ with a PhD.
• Experience with cryogenic mechanical design and product development lifecycle.
• Knowledge of design for manufacturing.
• Expertise with Finite Element Analysis (Thermal, Mechanical, EM) and 3D CAD (SolidWorks).

Responsibilities

• High density novel packaging solutions for quantum processor units.
• Cryogenic mechanical design for novel cryogenic signal conditioning sub-assemblies.
• Cryogenic mechanical design for signal delivery systems.
• Simulation-driven designs to reduce EMI within the qubit environment.
• Own end-to-end product development through requirements, design reports, design reviews, assembly/testing documentation, and final delivery.

Skills

Cryogenic mechanical engineering

Mechanical design principles

Cross-functional collaboration

Education

Bachelor's degree in mechanical engineering or related field

Tools

3D CAD (SolidWorks)

Finite Element Analysis (Ansys/COMSOL)

Design for manufacturing

Job description

Amazon’s Quantum Center is seeking a Research Engineer specializing in hardware design for cryogenic environments to drive end-to-end development of quantum processor packaging and signal delivery systems. You will apply 3D CAD, FEA, and manufacturing know-how in a cross-functional team to deliver robust, scalable hardware solutions for quantum computing applications.

The role demands hands-on experience with cryogenic mechanical engineering, design for manufacturing, and a proven track record