Quality Engineering Leader – PCB / PCBA (Subject Matter Expert)

J&T Business Consulting; Seymour (CT); On-site; USD 120,000 - 160,000; Full time

Job summary

J&T Business Consulting seeks a Quality Engineering Leader for PCB/PCBA to drive reliability across the product lifecycle. You will lead QA teams, direct supplier quality management, and guide root-cause investigations while ensuring compliance with IPC and industry standards.

This senior role requires deep PCB fabrication knowledge and a track record of preventing defects through data-driven investigations, FAI reviews, and collaboration with NPI and design teams.

Qualifications

• Bachelor’s degree in Electrical Engineering, Electronics Engineering, Materials Science, or related field.
• 10+ years in PCB fabrication or electronics quality leadership.
• Experience with IPC, AS9100, ISO 9001.

Responsibilities

• Define and deploy incoming inspection criteria and sampling plans for bare boards and materials based on IPC standards.
• Lead MRB dispositions and 8D/RCCA/CAPA investigations to prevent recurrence.
• Supervise and upskill quality engineers and inspectors, and collaborate with NPI/design teams.

Skills

PCB fabrication

Quality leadership

8D/RCMA investigations

SPC/Gauge R&R

DFM/DFA

Education

Bachelor’s degree in Electrical Engineering or related

Tools

ERP

MES

PLM

Job description

Quality Engineering Leader – PCB / PCBA (Subject Matter Expert)

Location: Seymour, CT

Position Type: Full-Time

Department: Quality Assurance & Reliability Engineering

Industry: Electronics Manufacturing Services (EMS) / PCBA Manufacturing

Position Overview

The Quality Engineering Leader – PCB / PCBA serves as the senior Subject Matter Expert (SME) responsible for ensuring that bare printed circuit boards and surface‑mount/through‑hole assemblies comply with rigorous internal standards, customer specifications, and industry quality frameworks throughout the product lifecycle.

This role bridges advanced PCB fabrication physics, hands‑on failure analysis, and quality management leadership. By directing quality engineers and inspectors, driving supplier quality management, leading root‑cause investigations, and conducting DFM/DFA reviews, this leader anchors product reliability and defect‑prevention across all stages of production.

Key Responsibilities

Quality Ownership for PCB & PCBA:

• Define, deploy, and maintain incoming inspection criteria, acceptance baselines, and statistical sampling plans for bare boards and raw materials based on IPC standards.
• Establish, execute, and update quality control plans, inspection protocols, and standard operating procedures for SMT and pin‑through‑hole (PTH) assembly lines.
• Direct Material Review Board (MRB) dispositions for non‑conforming components and assemblies; lead comprehensive 8D, RCCA, and CAPA investigations to eliminate recurrence.
• Supervise, mentor, and technically upskill quality engineers and floor inspection personnel.

Technical QA & PCB Subject Matter Expertise:

• Serve as the resident technical authority on PCB layer stack‑ups, laminate properties, copper weights, surface finishes (ENIG, HASL, Immersion Silver/Tin, ENEPIG), and manufacturability constraints.
• Audit and evaluate Gerber files, ODB++ packages, panel drawings, fabrication specifications, and assembly blueprints against DFM, DFA, and assembler design rules.
• Partner closely with NPI and design teams to identify board‑level risks early in the cycle, targeting trace geometries, aspect ratios, thermal relief, solderability, and testpad accessibility.

Supplier Quality Management & Collaboration:

• Audit, qualify, and monitor external PCB fabricators; evaluate vendor technical capability, yield rates, process control, and reliability for standard and complex multi‑layer boards.
• Direct First Article Inspections (FAI), review FAIR documentation, and audit Certificates of Conformance (CoC) for new board fabricators and revised artwork introductions.
• Issue and drive Supplier Corrective Action Requests (SCARs), tracking vendor performance metrics (PPM defect rates, on‑time FAI delivery, CAPA resolution timelines).
• Direct and perform hands‑on technical investigations and advanced lab evaluations, including cross‑sectioning/micro‑section analysis, X‑ray inspection, AOI review, and electrical test data analysis.
• Lead technical investigations on internal production escapes and customer RMA returns, conducting deep failure analysis to identify root causes and update quality procedures.
• Monitor and report on first‑pass yield trends, Defect Per Million Opportunities (DPMO), and scrap Pareto data; present actionable dashboards to executive Quality and Engineering leadership.
• Ensure strict compliance with industry and regulatory standards, including IPC‑A‑600, IPC‑A‑610, IPC‑6012, ISO 9001, AS9100, and customer quality agreements.

Qualifications & Experience Requirements

Education: Bachelor’s degree in Electrical Engineering, Electronics Engineering, Materials Science, or a related technical discipline (or equivalent specialized industry experience focused on PCB/PCBA technology).

Experience: Minimum 10+ years of dedicated experience in PCB fabrication, electronics manufacturing quality engineering, or technical QA leadership.

Technical Expertise:

• Deep command of bare‑board fabrication processes (subtractive/additive etching, multi‑layer lamination, blind/buried via plating, solder mask application) and assembly operations (SMT, wave/selective soldering, reflow, ICT, and functional testing).
• Comprehensive working knowledge of IPC bare‑board and assembly specifications (IPC‑A‑600, IPC‑A‑610, IPC‑6012 Class 2 and Class 3).
• Proven background reading and interpreting electrical schematics, fabrication drawings, PCB stack‑ups, Gerber files, and ODB++ datasets.

Quality Methods:

• Demonstrated mastery of core quality methodologies: 8D problem‑solving, PFMEA, Statistical Process Control (SPC), Gauge R&R, control plans, and process capability ( $C_{pk} ) analysis.
• Proven track record leading cross‑functional RCCA/CAPA investigations across internal lines and external supply chains.

Preferred Credentials:

• Hands‑on familiarity with failure analysis tools: metallographic micro‑sectioning, automated X‑ray inspection (AXI), AOI platforms, and automated test environments.
• Working knowledge of ERP, MES, and PLM revision control systems for traceability.
• Professional quality certifications (e.g., ASQ Certified Quality Engineer - CQE, Certified Six Sigma Black/Green Belt, or Certified IPC Specialist/Trainer).

Core Competencies

Technical Depth: Recognized subject‑matter authority across bare‑board fabrication chemistry, PCB mechanics, and surface‑mount soldering physics.

Data‑Driven Analysis: Ability to isolate root causes in complex electro‑mechanical assemblies using empirical data and disciplined analytical methods.

Cross‑Functional Influence: Confidence to constructively challenge customer designs or supplier processes to protect board reliability while sustaining positive professional relationships.

End-to-End Ownership: Proactive accountability for board‑level quality and reliability from initial NPI design handoff through full‑scale production shipment.