Program Management Engineer | Space Power

118-WW TMG MFG OPS; Dallas (TX); On-site; USD 120,000 - 180,000; Full time

Job summary

118-WW TMG MFG OPS is seeking a Project Engineer/Program Manager to lead cross-functional teams from concept to production ramp for multiple semiconductor products. You will create detailed project plans, manage schedules and risks, and coordinate global development activities across Design, Engineering, Validation, Manufacturing, Quality, and Operations.

The role requires 5+ years in project engineering or program management for semiconductor development programs and a proven ability to

Qualifications

• Bachelor’s or Master’s degree in Electrical Engineering, Mechanical Engineering, or related engineering discipline.
• At least 5+ years of project engineering and/or program management experience supporting complex semiconductor products or technical development programs.
• Proven experience leading cross-functional global teams in fast-paced development environments.

Responsibilities

• Lead cross-functional teams through successful execution and release of multiple new products from concept through production ramp.
• Create, maintain, and drive comprehensive project plans including schedule management, risk assessment, resource alignment, budget considerations, and milestone tracking.
• Coordinate global development activities across Design, Systems & Applications, Product Engineering, Validation, Test Engineering, Manufacturing, Quality, Firmware/Software, and Operations teams.
• Drive strong cross-functional collaboration and maintain clear communication channels to ensure alignment, timely issue resolution, and successful project execution.
• Partner with wafer fabrication, assembly, and test sites to support schedule adherence, production readiness, cost targets, and quality objectives.
• Interface with internal stakeholders, external customers, and subcontractors to communicate project status, manage deliverables, and support key customer milestones.
• Lead regular project reviews and provide clear weekly/monthly updates to management, highlighting project status, risks, dependencies, recovery plans, and support needed.
• Coordinate qualification activities and reliability plans in partnership with Product Engineering, Quality & Reliability Engineering, and Failure Analysis teams.
• Support root-cause investigations and drive cross-functional resolution plans for technical, manufacturing, reliability, or schedule-related challenges.
• Ensure integrated circuits meet product, reliability, characterization, and manufacturing requirements prior to production release.
• Drive execution of material logistics, sample coordination, wafer starts, shipment priorities, and assembly/test scheduling activities.
• Maintain accurate project tracking and documentation within internal development systems and tools throughout the product lifecycle.
• Foster a collaborative, positive, and execution-focused team environment while motivating cross-functional teams toward shared goals and successful outcomes.
• Success in this role will be measured by the ability to effectively lead complex programs, build strong working relationships across organizations, and consistently deliver results aligned with project commitments and business objectives.

Skills

Cross-functional leadership

Project management

Schedule management

Risk assessment

Resource alignment

Communication

Education

Bachelor’s or Master’s degree in Electrical Engineering or Mechanical Engineering

Tools

MS Project

SAP

Job description

Responsibilities include:

• Lead cross-functional teams through the successful execution and release of multiple new products from concept through production ramp.
• Create, maintain, and actively drive comprehensive project plans including schedule management, risk assessment, resource alignment, budget considerations, and milestone tracking.
• Coordinate global development activities across Design, Systems & Applications, Product Engineering, Validation, Test Engineering, Manufacturing, Quality, Firmware/Software, and Operations teams.
• Drive strong cross-functional collaboration and maintain clear communication channels to ensure alignment, timely issue resolution, and successful project execution.
• Partner closely with wafer fabrication, assembly, and test sites to support schedule adherence, production readiness, cost targets, and quality objectives.
• Interface with internal stakeholders, external customers, and subcontractors to communicate project status, manage deliverables, and support key customer milestones.
• Lead regular project reviews and provide clear weekly/monthly updates to management, highlighting project status, risks, dependencies, recovery plans, and support needed.
• Coordinate qualification activities and reliability plans in partnership with Product Engineering, Quality & Reliability Engineering, and Failure Analysis teams.
• Support root-cause investigations and drive cross-functional resolution plans for technical, manufacturing, reliability, or schedule-related challenges.
• Ensure integrated circuits meet product, reliability, characterization, and manufacturing requirements prior to production release.
• Drive execution of material logistics, sample coordination, wafer starts, shipment priorities, and assembly/test scheduling activities.
• Maintain accurate project tracking and documentation within internal development systems and tools throughout the product lifecycle.
• Foster a collaborative, positive, and execution-focused team environment while motivating cross-functional teams toward shared goals and successful outcomes.
• Success in this role will be measured by the ability to effectively lead complex programs, build strong working relationships across organizations, and consistently deliver results aligned with project commitments and business objectives.

Minimum requirements:

• Bachelor’s or Master’s degree in Electrical Engineering, Mechanical Engineering, or related engineering discipline.
• 5+ years of project engineering and/or program management experience supporting complex semiconductor products or technical development programs.

Preferred qualifications:

• Proven experience leading cross-functional global teams in fast-paced development environments.
• Demonstrated ability to influence and drive alignment across organizations without direct reporting authority.
• Strong verbal and written communication skills with the ability to communicate effectively across technical and non-technical teams.
• Experience managing multiple projects simultaneously while balancing priorities, schedules, and available resources.
• Strong analytical, organizational, and problem-solving skills with attention to detail and execution.
• Ability to work effectively in dynamic environments with changing priorities and aggressive timelines.
• Demonstrated ability to build strong partnerships and collaborate effectively across diverse functional teams.
• Experience managing semiconductor product development programs from concept through production release.
• Knowledge of semiconductor wafer fabrication, device packaging, assembly, and production test processes.
• Familiarity with product qualification, reliability requirements, and characterization methodologies.
• Experience coordinating activities across global development and manufacturing sites.
• Ability to develop realistic project schedules and drive execution across highly matrixed organizations.
• Experience supporting customer engagements, milestone tracking, sample coordination, and production ramp activities.
• Strong leadership presence with the ability to motivate teams, facilitate discussions, and drive decisions through collaboration and influence.
• Self-motivated individual with strong initiative, ownership mindset, and a proactive approach to problem solving.
• Experience using project planning and tracking tools such as MS Project, SAP, or related program management systems.
• Ability to thrive in highly interactive team environments that value communication, teamwork, and shared problem solving.