Profit Center Manager, Printed Circuit Board Assembly

Jobtailor

New Haven (CT)

On-site

USD 95,000 - 125,000

Full time

14 days+
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Job summary

Jobtailor in New Haven, CT, seeks an experienced Manufacturing Engineer to lead SMT/PCBA process development and NPI activities. You will implement tooling, documentation, and process improvements across PCBAs, and collaborate with cross-functional teams to optimize yield and delivery.

The role requires 5+ years in SMT/PCBA and Lean manufacturing, with hands-on expertise in stencil design, SPI/AOI, and reflow processes.

Qualifications

  • BS in Manufacturing/Industrial Eng or related field.
  • Minimum 5 years SMT/PCBA development experience.
  • Lean Manufacturing experience required.
  • Strong SMT process development and technical leadership.
  • Proven track record improving yield, quality, cycle time.

Responsibilities

  • Develop and implement tooling, processes, documentation, and instructions for PCBA.
  • Conduct DOE, PFMEA, and other methods to improve processes and quality.
  • Configure BOMs and routings for PCBA/systems per product structures and procedures.
  • Demonstrate knowledge of stencil design, solder paste, stencil printing, pick and place, and solder reflow.
  • Determine root causes of PCBA defects and implement changes.
  • Review assembly operations for accuracy and optimization.
  • Lead NPI activities for all electronic assemblies.
  • Order equipment, tools, and instruments for new processes.

Skills

SMT Development
PFMEA
DOE
Lean Manufacturing
NPI

Education

Bachelor's in Manufacturing/Industrial Eng

Tools

SPI
AOI
Reflow Ovens
Placement Equipment
Microsoft Office Suite

Job description

  • Develop and implement tooling, processes, documentation, and instructions for PCBAs.
  • Conduct Design of Experiments (DOE), Process Failure Mode and Effects Analysis (PFMEA), and other methodologies to improve processes and quality.
  • Configure Bill of Materials (BOMs) and routings for Printed Circuit Board Assemblies (PCBA)/systems in accordance with product structures, standards, and internal procedures.
  • Demonstrate strong knowledge of stencil design, solder paste characteristics, stencil printing, pick and place, and solder reflow processes.
  • Determine root causes of PCBA defects and implement necessary changes.
  • Continuously review assembly operations for accuracy, proper manufacturing methods, and optimization of manufacturing processes.
  • Participate in and lead New Product Introduction (NPI) activities for all electronic assemblies.
  • Order equipment, tools, and instruments for new processes.
Requirements
  • Bachelor of Science in Manufacturing Engineering, Industrial Engineering or related field of study.
  • Must have a minimum of 5 years of Surface Mount Technology (SMT) or PCBA development experience.
  • Lean Manufacturing experience is required.
  • Strong background in Surface Mount Technology (SMT) processes and process development, with the ability to serve as a technical expert.
  • Proven ability to lead improvements in process yield, quality, cycle time, inventory accuracy, and delivery.
  • Proficiency in Surface Mount Technology (SMT) equipment programming and troubleshooting, including placement equipment, Solder Paste Inspection (SPI), Automated Optical Inspection (AOI), printing, and reflow ovens.
  • Proficient in Microsoft Office Suite (Word, Excel, PowerPoint, Access, Outlook).
Core Competencies

Demonstrates expertise in Surface Mount Technology (SMT) processes and development, with a strong focus on improving process yield, quality, and efficiency in PCB assembly. Proficient in leading New Product Introduction (NPI) activities and optimizing manufacturing processes through effective tooling and documentation.

Highest-signal resume keywords
  • Surface Mount Technology (SMT) Development
  • Process Failure Mode and Effects Analysis (PFMEA)
  • Design of Experiments (DOE)
  • Lean Manufacturing
  • New Product Introduction (NPI)
ATS Optimization Keywords
Hard Skills
  • Surface Mount Technology (SMT) Processes
  • Process Development
  • Root Cause Analysis
  • Bill of Materials (BOM) Configuration
  • Stencil Design
  • Solder Paste Characteristics
  • Solder Reflow Processes
  • Manufacturing Process Optimization
  • Equipment Programming and Troubleshooting
  • Quality Improvement
Industry Keywords
  • Printed Circuit Board Assemblies (PCBA)
  • Manufacturing Engineering
  • Industrial Engineering
  • Assembly Operations
  • Process Yield
  • Cycle Time
  • Inventory Accuracy
  • Delivery
Tools & Technologies
  • Microsoft Office Suite
  • Solder Paste Inspection (SPI)
  • Automated Optical Inspection (AOI)
  • Reflow Ovens
  • Placement Equipment
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